Conductivity improvement of isotropically conductive adhesives

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 236-241

  Li, Yi ^a   Moon, Kyoung Sik ^a   Li, Haiying ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADIPIC ACID (ACID A); CONTACT RESISTANCE; ELECTRICALLY CONDUCTIVE ACID (ECA); MALONIC ACID;

ADHESIVES; CARBOXYLIC ACIDS; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY OF LIQUIDS; SELF ASSEMBLY; THERMOMECHANICAL TREATMENT; VISCOSITY;

ELECTRONICS PACKAGING;

EID: 14844286475     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. D.J. Small, B. Eisenach, A. Lewis, and A. Babiarz, "Electrically Conductive Adhesives as an Alternative to Solder," Advanced Packaging, Jan, 1999, pp.38-42.
2. K. Gilleo, "Evaluating Polymer Solders for Pb-free Assembly," Circuits Assembly, Jan. 1994, pp. 52; Feb. 1994, pp.50.
3. K. Gilleo, "Evaluating Polymer Solders for Pb-free Assembly," Circuits Assembly, Jan. 1994, pp. 52; Feb. 1994, pp.50.
4. D.J. Small, B. Eisenach, A. Lewis, and A. Babiarz, "Electrically Conductive Adhesives as an Alternative to Solder," Advanced Packaging, Jan, (1999), pp.38-42.
5. S. Corbett and M.J. Domiano, "Processing with Polymer Solders," Surface Mount Technology, June (1997), pp.48-52.
6. D. Lu, Q. Tong, and C.P. Wong, "A Fundamental Study on Silver Flakes for Conductive Adhesives," Proceedings of the 4th International Symposium on Advanced Packaging Materials, Braselton, GA, 1998, pp. 256-260.
7. D. Lu, Q.K. Tong, and C.P. Wong, "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives," Proceedings of the 49th Electronic Components and Technology Conference, Part C, Vol. 22, No. 3, 1999, pp. 228-232.