Modelling of ICA creep properties

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 194-198

  Rusanen, O ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Bonding; Capacitive sensors; Costs; Creep; Elasticity; Flip chip; Hysteresis; Independent component analysis; Thermal stresses; Viscosity

Indexed keywords

ADHESIVES; BONDING; CAPACITIVE SENSORS; COATINGS; COST BENEFIT ANALYSIS; COSTS; ELASTICITY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HYSTERESIS; INDEPENDENT COMPONENT ANALYSIS; JOINING; LEAD; MANUFACTURE; STRAIN; STRESS RELAXATION; STRESS-STRAIN CURVES; THERMAL STRESS; VISCOSITY;

CREEP COMPLIANCE; CREEP PROPERTIES; FATIGUE LIFETIME; FLIP CHIP; FLIP CHIP BONDING; RECOVERABLE STRAIN; STRESS-STRAIN HYSTERESIS; VISCOELASTIC BEHAVIOUR;

CREEP;

EID: 84952317997     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860597     Document Type: Conference Paper

References (23)

1. Akay, H.U., Paydar, N.H., Zhang, H. & Glogas, G. 1998. Viscoelastic Study of a Conductive Adhesive for Electronic Packages, Part 2: Thermal Stress Analysis Using Finite Element Method. International Journal of Microelectronic Packaging, Materials and Technologies, Vol. 1, No. 3, pp. 225-233.
2. Aklonis, J.J. & MacKnight, W.J. 1983. Introduction to Polymer Viscoelasticity. Second Edition. New York: John Wiley and Sons. 295 p. ISBN 0-471-86729-2.
3. Darveaux, R. & Banerji, K. 1991. Fatigue Analysis of Flip Chip Assemblies Using Thermal Stress Simulations and a Coffin-Manson Relation. Proceedings of the 41st Electronic Component and Technology Conference, Atlanta, May 11-16. Pp. 797-805.
4. Dasgupta, A. 1993. Failure Mechanism Models for Cyclic Fatigue. IEEE Transactions on Reliability, Vol. 42, No. 4, pp. 548-555.
5. Doi, K., Hirano, N., Okada, T., Hiruta, Y. & Sudo, T. 1996. Prediction of Thermal Fatigue Life for Encapsulated Flip Chip Interconnection. International Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 3, pp. 231-237.
6. Dudek, R., Vogel, D. & Michel, B. 1996. Mechanical Failure in COB-Technology Using Glob-Top Encapsulation. IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part C, Vol. 19, No. 4, October 1996, pp. 232-240.
7. Dudek, R., Scherzer, M. & Schubert, A. 1998. FE-Simulation for Polymeric Packaging Materials. IEEE Transactions on Components, Hybrids, and Manufacturing Technology - Part A, Vol. 21, No. 2, pp. 301-309.
8. Gektin, V., Bar-Cohen, A. & Witzman, S. 1996. Thermo-Structural Behaviour of Underfilled Flip Chips. Proceedings of the IEEE 46th Electronic Components and Technology Conference, Orlando, May 28-31. Pp. 440-447.
9. Gektin, V., Bar-Cohen, A. & Ames, J. 1997. Coffin-Manson Fatigue Model of Underfilled Flip-Chips. IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 20, No. 3, pp. 317-326.
10. Gradin, P., Howgate, P.G., Seldénn, R. & Brown, R.A. 1989. Dynamic-Mechanical Properties. In: Allen, G. & Bevington, J.C. (ed.). Comprehensive Polymer Science, Volume 2, Polymer Properties. Pergamon Press. 798 p.
11. Hughes, E.J. & Rutherford, J.L. 1980. Stress Dependence of Creep in Bonded Adhesives. Materials Science and Engineering, Vol. 44, pp. 57-62.
12. Lau, J.H. & Pao, Y.H. 1997. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. McGraw-Hill. 408 p. ISBN 0-07-036648-9.
13. LeClair, T., Harper, A., Graham, S. & Ackley, D. 1998. Flip Chip Interconnection of DNA Chip Devices. Proceedings of the International Symposium on Microelectronics, San Diego, November 1-4. Pp. 732-736.
14. th ISHM-Nordic Annual Conference, Oslo, September 21-24. Pp. 161-169.
15. rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, September 28-30, pp. 305-311.
16. st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, October 13-15. Pp. 299-307.
17. Rafanelli, A.J. 1996a. Thermo-Mechanical Creep Characteristics of Electrically Conductive Epoxy Adhesives at Room Temperature. Proceedings of the 5th InterSociety Conference on Thermal Phenomena in Electronic Systems, Orlando, May 29-June 1. Pp. 299-305.
18. Rafanelli, A.J. 1996b. A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies Part II: Thermal Stability and Thermo-Mechanical Creep. Proceedings of the ASME International Mechanical Engineering Congress and Exposition, Atlanta, November 17-22. Pp. 45-58.
19. Reinikainen, T. & Kivilahti J. 1999. Deformation Behaviour of Dilute SnBi (0.5 to 6 At. Pet) Solid Solutions. Metallurgical and Materials Transactions, Vol. 30A, January 1999, pp. 123-132.
20. Rusanen, O. & Lenkkeri, J. 1999. Thermal Stress Induced Failures in Adhesive Flip Chip Joints. International Journal of Microcircuits & Electronic Packaging, Vol. 22, No. 4, pp. 363-369.
21. Rusanen, O. 2000. Adhesives in Micromechanical Sensor Packaging. Doctoral dissertation. VTT Publications 407, 74 p. + app. 54 p.
22. Wu, S.W., Mei, Y., Yeh, C. & Wyatt, K. 1996. Process Induced Residual Stresses in Isotropically Conductive Adhesive Joints. Proceedings of Adhesives in Electronics '96, Stockholm, June 3-5. Pp. 133-140.
23. Yeh, C., Zhou, W.X. & Wyatt, K. 1996. Parametric Finite Element Analysis of Flip Chip Reliability. International Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 2, pp. 120-127.