Microwave cure of metal-filled electrically conductive adhesive

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 593-597

  Wang, T ^a   Fu, Y ^a   Becker, M ^a   Liu, J ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE PLASTICS; CURING; DIELECTRIC MATERIALS; ELECTROMAGNETIC FIELDS; ELECTROMAGNETIC WAVE ABSORPTION; HEAT TRANSFER; MICROWAVE HEATING; SUBSTRATES; TEMPERATURE MEASUREMENT; THERMOPLASTICS; THERMOSETS;

ELECTRICALLY CONDUCTIVE ADHESIVE; VARIABLE FREQUENCY MICROWAVE;

PLASTIC ADHESIVES;

EID: 0034828426     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927789     Document Type: Article

References (15)

1. Basic ideas of microwave processing of polymers
2. Overview on microwave cure of polymeric materials
3. Microwave processing: Fundamentals and applications
4. Review of cure of polymers and composites by microwave energy
5. Kinetics of the crosslinking reaction of a bisnadimide model compound in thermal and microwave cure process
6. A homogeneous microwave curing process for epoxy/glass fiber composites
7. Effects of microwave processing on fiber-matrix adhesion in composites
8. Enhanced chemical bonding at the fiber-matrix interphase in microwave processed composites
9. Heating and reliability characteristics of electrically conductive adhesives using variable frequency microwave cure
10. Encapsulants microwave curing for electronic packages
11. Microwave heating: An evaluation of power formulations
12. Microwave transmission through electrically conductive adhesives
13. Electrical conduction models for electrically conductive adhesives
14. Appendices
15. Chapter 10 radiation heat transfer