Microwave-transmission, heat and temperature properties of electrically conductive adhesive

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 193-198

  Fu, Ying ^a   Wang, T ^a   Liu, Johan ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Electrically conductive adhesive; Heat generation; Heat rate; Microwave curing; Microwave transmission

Indexed keywords

CALCULATIONS; CURING; ELECTRIC CONDUCTIVITY; ELECTROMAGNETIC FIELDS; FILLER METALS; HEAT TRANSFER; MATHEMATICAL MODELS; PLASTIC ADHESIVES; SKIN EFFECT; TEMPERATURE; THERMAL CONDUCTIVITY; THERMODYNAMIC STABILITY;

ELECTRICALLY CONDUCTIVE ADHESIVE; MICROWAVE POWER ABSORPTION; MICROWAVE TRANSMISSION; THERMAL EQUILIBRIUM;

MICROWAVE HEATING;

EID: 0037804759     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.806179     Document Type: Article

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