Reliability Assessment of Isotropically Conductive Adhesive Joints in Surface Mount Applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 2, 1995, Pages 305-312

  Rörgren, Roger S ^a   Liu, Johan ^a  

^a SWEREA IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINING; CONDUCTIVE ADHESIVE JOINING TECHNOLOGY; CONTACT RESISTANCE; QUAD FLAT PACKAGE; RELIABILITY ASSESSMENT; SURFACE INSULATION RESISTANCE;

ADHESION; ADHESIVES; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; JOINING; MATERIALS TESTING; METALLIZING; RELIABILITY; STRENGTH OF MATERIALS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

PRINTED CIRCUIT MANUFACTURE;

EID: 0029305739     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.386266     Document Type: Article

References (9)

1. L. Li, Ch. Lizzul, K. Hansoo, I. Sacolick, and J. E. Morris, “Electrical, structural and processing properties of electrically conductive adhesives,” IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, no. 8, pp. 843-851, Dec. 1993.
2. H. Hvims, “Electrically conductive adhesives for SMT,” Elektronik Centralen, Hoersholm, Denmark, Rep. ECR-255, July 1993.
3. D. C. Whalley, D. J. Williams, A. Y. Ogunjimi, and J. M. Goward, “The use of loaded adhesives for electronic interconnect,” Loughborough University of Technology, Dept Manufact. Eng., Leicestershire, UK, SERC/ACME Final Rep. GR/H21241 1993.
4. J. Liu, R. Rörgren, and L. Ljungkrona, “High-volume electronics manufacturing using conductive adhesives for surface mounting,” in Proc. Surface Mount Int., 1994, pp. 291-302.
5. G. P. Nguyen, J. R. Williams, F. W. Gibson, and T. Winster, “Electrical reliability of conductive adhesive for surface-mount applications,” in Proc. ISHM-USA, 1993, pp. 50-55.
6. J.-E. Homtvedt “Experience of using conductive adhesives in hybrid circuitry,” presented at the IVF Int. Seminar on Recent Achievements in Conductive Adhesive Joining Technology in Electronics Manufacture, Gothenburg, Sweden, Sept. 23-24, 1993.
7. K. Gilleo and N. Socoloski “Are ‘polymer solders’ real? Metallurgical versus adhesive joining,” in Proc. Nepcon West, 1994, pp. 922-930.
8. R. Rörgren and J. Liu, “Reliability of isotropically conductive adhesive joints in surface mount application,” The Swedish Institute of Production Engineering Research, Gothenburg, Sweden, Rep. 93/35, 1993.
9. J. Liu and L. Ljungkrona, “Development of conductive adhesive joining technology for surface-mounting electronics manufacturing,” IEEE Trans. Comp., Hybrids, Manufact. Technol., vol 18, pp. 313-319, this issue.