Fracture behavior of isotropically conductive adhesives

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 209-214

  Gupta, Sandeep ^a   Hydro, Ryan M ^a   Pearson, Raymond A ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; CONTACT ANGLE; CRACKS; ELECTRON MICROSCOPY; EPOXY RESINS; FRACTURE MECHANICS; FRACTURE TOUGHNESS; OPTICAL MICROSCOPY; SILVER;

CRACK PATH DEFLECTION; ISOTROPICALLY CONDUCTIVE ADHESIVES;

ELECTRONICS PACKAGING;

EID: 0033320362     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774733     Document Type: Article

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