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Volumn 1, Issue 3, 1998, Pages 159-175
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Introduction to electrically conductive adhesives
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
ANISOTROPY;
CONDUCTIVE FILMS;
MICROPROCESSOR CHIPS;
MORPHOLOGY;
PRINTED CIRCUIT BOARDS;
SOLDERING;
SUBSTRATES;
SURFACE MOUNT TECHNOLOGY;
THERMAL EXPANSION;
ANISOTROPIC CONDUCTIVE ADHESIVE FILMS (ACAF);
ANISOTROPIC CONDUCTIVE ADHESIVES (ACA);
COEFFICIENT OF THERMAL EXPANSION (CTE);
ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);
HEAT SEAL CONNECTORS (HSC);
ISOTROPIC CONDUCTIVE ADHESIVES (ICA);
NONCONDUCTIVE ADHESIVES (NCA);
TAPE AUTOMATED BONDING (TAB) PACKAGES;
ELECTRONICS PACKAGING;
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EID: 0032302574
PISSN: 10236228
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (17)
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References (117)
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