1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 3, 1999, Pages 446-454

  Vandamme, L K J ^a   Périchaud, Marie Geneviève ^b   Noguera, E ^c   Danto, Yves ^b   Behner, Ulrich ^d,e  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSITÉ BORDEAUX 1   (France)

^c UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

^d DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^e ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION; ELECTRIC CONTACTS; FAILURE ANALYSIS; MATHEMATICAL MODELS; PLASTIC ADHESIVES; RELIABILITY; SPURIOUS SIGNAL NOISE; STRESS ANALYSIS; THERMAL CYCLING;

CONDUCTIVE ADHESIVE BONDS; LOW FREQUENCY NOISE;

ELECTRONICS PACKAGING;

EID: 0033335376     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.796549     Document Type: Article

References (15)

1. H. Kristiansen and J. Liu, "Overview on conductive adhesive interconnection technologies for LCD's," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 208-214, June 1998.
2. M. G. Perichaud, J. Y. Deletage, D. Carboni, H. Fremont, Y. Danto, and C. Faure, "Thermomechanical behavior of adhesive jointed SMT components," in Proc. 3rd Int. Conf. Adhesive Joining Coating Technol. Electron. Manufact., Binghamton, NY, 1998, pp. 55-61.
3. L. K. J. Vandamme, "Noise as a diagnostic tool for quality and reliability of electronic devices," IEEE Trans. Electron Devices, vol. 41, pp. 2176-2187, Nov. 1994.
4. E. P. Vandamme and L. K. J. Vandamme, "1/f noise and its coherence as a diagnostic tool for quality assessment of potentiometers," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 17, pp. 436-445, Sept. 1994.
5. U. Behner, R. Haug, R. Schutz, and H. L. Hartnagel, "Characterization of anisotropically conductive adhesive interconnections by 1/f noise measurements," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, p. 243, June 1998.
6. U. Behner, B. Pfeiffer, S. Kotthaus, R. Haug, S. Schutz, L. J. K. Vandamme, and H. L. Hartnagel, "Characterization of isotropically conductive adhesives by 1/f noise," Appl. Phys. A, to be published.
7. L. K. J. Vandamme and R. Tijburg, "1/f noise measurements for characterizing multispot low-ohmic contacts," J. Appl. Phys., vol. 47, pp. 2056-2058, 1976.
8. L. H. F. Ortmans and L. K. J. Vandamme, "Characterization of impulse-fritting procedures of contacts by measuring 1/f noise," Appl. Phys., vol. 9, pp. 147-151, 1976.
9. S. Kotthaus, R. Haug, H. Schafer, and O.-D. Hennemann, "Current induced degradation of isotropically conductive adhesives," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 259-265, June 1998.
10. J. H. Scofield, "AC method for measuring low-frequency resistance fluctuation spectra," Rev. Sci. Instrum., vol. 58, pp. 985-993, 1987.
11. A. H. Verbruggen, H. Stoll, K. Heeck, and R. H. Koch, "A novel technique for measuring resistance fluctuations independently of background noise," Appl. Phys., vol. A48, pp. 233-236, 1998.
12. L. J. K. Vandamme, "On 1/f noise in ohmic contacts," Ph.D. thesis, Eindhoven Univ. Technol., The Netherlands, 1976.
13. J. H. Constable, T. Kache, H. Teichmann, S. Muehle, and M. A. Gaynes, "Continuous electrical resistance monitoring, pull strength and fatigue life of isotropically conductive adhesive joints," in Proc. 3rd Int. Conf. Adhesive Joining Coating Technol. Electron. Manufact., Binghamton, NY, 1998, pp. 76-83.
14. R. Holm, Electric Contacts: Theory and Applications, 4th ed. Berlin, Germany: Springer-Verlag, 1967, pp. 135-152.
15. J. A. Greenwood, "Constriction resistance and the real area of contact," in Proc. 3rd Int. Res. Symp. Electron. Contact Phenom., Univ. Maine, Orono, June 1966, pp. 5-13.