Thermo-mechanical properties of epoxy formulations with low glass transition temperatures

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 226-231

  Luo, Shijian ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Epoxy; Moisture absorption; Thermo mechanical property

Indexed keywords

CHARACTERIZATION; CHELATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; ETHERS; GLASS; MECHANICAL PROPERTIES; MICROELECTRONICS; MOISTURE; PACKAGING MATERIALS; PICKUPS; TEMPERATURE;

1 ,4-BUTANEDIOL DIGLYCIDYL ETHERS; COBALT ACETYLACETONATE; DIFFERENTIAL SCANNING CALORIMETERS; EPOXY; LOW GLASS TRANSITION TEMPERATURES; MICROELECTRONICS INDUSTRY; MOISTURE ABSORPTION; THERMOMECHANICAL PROPERTIES;

GLASS TRANSITION;

EID: 84949983648     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990391     Document Type: Conference Paper

References (8)

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7. Shijian Luo, Johannes Leisen and C. P. Wong, "Study on mobility of water and polymer chain in Epoxy for Microelectronic Applications", Proceedings of 51st Electronic Components & Technology Conference, May 2001, Lake Burena Vista, FL, p. 149.
8. th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, P70, Espoo, Finland, June 2000.