Lubricants of silver fillers for conductive adhesive applications

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 184-192

  Wong, C P ^a   Lu, D ^a   Tong, Q K ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NATIONAL STARCH AND CHEMICAL COMPANY   (United States)

Author keywords

electrically conductive adhesives; interaction; lubricants; Silver flakes

Indexed keywords

ADHESIVES; COATINGS; DECOMPOSITION; DIFFERENTIAL SCANNING CALORIMETRY; FILLERS; INFRARED SPECTROSCOPY; JOINING; MANUFACTURE; SILVER; THERMOGRAVIMETRIC ANALYSIS;

COMPOSITES OF POLYMERS; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; DIFFUSE REFLECTANCE INFRARED SPECTROSCOPY; ELECTRICALLY CONDUCTIVE ADHESIVES; INTERACTION; ORGANIC LUBRICANTS; OTHER PROPERTIES;

LUBRICANTS;

EID: 33644919863     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742025     Document Type: Conference Paper

References (14)

1. B.T. Alphert and A.J. Schoenberg, "Conductive Adhesives as A Soldering Alternative", Electronic Packaging & Production, 130 (1991).
2. A.O. Ogunjimi, O. Boyle, D.C. Whalley, and D.J. Williams, "A Review of the Impact of Conductive Adhesive Technology on Interconnection," Journal of Electronics Manufacturing, vol. 2, p. 109 (1992).
3. CP Wong, D. Lu, S. Vona, and Q. Tong, "Fundamental Understanding of Electrically Conductive Adhesives", Ist IEEE International Polymeric Electronics Packaging, p.80 (1997).
4. R. Pound, "Conductive Epoxy is Tested for SMT Solder Replacement", Adhesive Age, vol. 25, p. 86 (1985).
5. H.L. Hvims and E. Centralen, "Solder Replacement", IEEE/CHMT int '1 electronics manufacturing technoloo symposium, vol. 15, p. 128 (1993).
6. Y.C. Lee and P.M. Williams, "Solderless Connection Technology", Manufacturing Aspects in Electronics Packaging, vol. 65, p. 71 (1993).
7. J.C. Jagt, P.J.M. Beris, and G.F.C.M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?", IEEE transactions on components, packaging and manufacturing technology, vol. 18(2), p. 292 (1995).
8. P.G. Harris, " Conductive Adhesives: A Critical Review of Progress to Date", Soldering and Surface Mount Technology, 4p., May 20, 1995.
9. M. Zwolinski, J. Hickman, and H. Rubin, " Electrically conductive adhesives for surface mount solder replacement", IEEE transactions on components, packaging and manufacturing technology, 19(4), 241 (1996).
10. E.M. Jost and Kirk MaNeilly, "Silver Flake Production and Optimization for Use in Conductive Polymers," ISHM'87 Proceedings, p. 548 (1987).
11. A. J. Lovinger, "Development of Electrical Conduction in Silver-filled Epoxy Adhesives," Journal of Adhesion, vol. 10, p. 1 (1979).
12. R.M. Silvertein and G. Clayton, Spectrometric Identification of Organic compounds, 5th ed., p. 118, Wiley, New York (1991).
13. L.K. Chau and M.D. Porter, "Fluorinated Monomolecular Assemblies: Model Systems to Probe Chemical Interactions at the Polymermetal Interface", Materials Research Society Symposium Proceedings, vol. 154, p. 310 (1988).
14. A.J. Lovinger, US Patent 4,356,505, "Conductive adhesive system including a conductivity enhancer", 1982.