Characterization of anisotropically conductive adhesive interconnections by 1/f noise measurements

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 243-248

  Behner, U ^a   Haug, R ^a   Schuetz, R ^a   Hartnagel, H L ^a  

^a ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; COPPER; FILLERS; GOLD; METALLIZING; NICKEL ALLOYS; PARTICLES (PARTICULATE MATTER); POINT CONTACTS; SIGNAL NOISE MEASUREMENT; SPURIOUS SIGNAL NOISE; SUBSTRATES;

ANISOTROPICALLY CONDUCTIVE ADHESIVES;

ELECTRONICS PACKAGING;

EID: 0031347078     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)