Reliability studies of an isotropic electrically conductive adhesive

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 61-69

  Morris, James E ^a   Anderssohn, Falk ^b   Kudtarkar, Santosh ^c   Loos, Enrico ^d  

^a PORTLAND STATE UNIVERSITY   (United States)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^c State University of New York at Binghamton   (United States)

^d CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; CURING; RELIABILITY; VACUUM APPLICATIONS;

ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);

ADHESIVES;

EID: 0035791567     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. S. Norlyng, Advancing Microelectronics, July/August 2001, 28-32
2. Li Li & J. E. Morris, Int. J. Microelectronic Packaging, 1(3) 1998, pp. 159-175
3. J. Liu & J. E. Morris, Proc. 1999 Workshop on Polymeric Materials in Microelectronics & Photonics (POLY'99,) Paris, Dec 1999, 259-281
4. rd Microelec. Materials Conference, Berlin April 2000, 181-186
5. S. MacDavitt & J. E. Morris, Proc. Adhesives 2000, Helsinki, 221-224
6. S. Probsthain & J. E. Morris, Proc. Adhesives 2000, Helsinki, 41-45
7. J. E. Morris, Chapter 3 in "Electrically Conductive Adhesives: A Comprehensive Review" J. Liu editor, Electrochemical Press, UK, (1999) 37-77
8. Q. Tong, S. Vona, R. Kuder & D. Shenfield, Proc. Adhesives'98, Binghamton, NY, 272-277