Simulation of the aging behavior of isotropic conductive adhesives

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings

Volumn , Issue , 2002, Pages 68-72

  Mundlein M ^a   Hanreich, G ^a   Nicolics, J ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; CONTACT RESISTANCE; DEGRADATION; ENVIRONMENTAL IMPACT; MICROELECTRONICS; POLYMERS; SILVER;

CURRENT DISTRIBUTION; DEGRADATION MECHANISM; ELECTRICAL CONTACT RESISTANCE; INTERPARTICLE CONTACTS; ISOTROPIC CONDUCTIVE ADHESIVES; MACROSCOPIC BEHAVIORS; METALLOGRAPHIC CROSS SECTIONS; RANDOMLY DISTRIBUTED;

PHOTONICS;

EID: 84962265126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2002.1020185     Document Type: Conference Paper

References (11)

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