Measurements of electrical resistivity and raman scattering from conductive die attach adhesives

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 132-138

  Miragliotta, Joseph ^a   Benson, Richard C ^a   Phillips, Terry E ^a   Emerson, John A ^b  

^a JOHNS HOPKINS UNIVERSITY APPLIED PHYSICS LABORATORY   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Conductive adhesive; Enhanced Raman scattering; Surface adsorbate; Thermal curing

Indexed keywords

ADHESIVES; ADSORBATES; AMORPHOUS CARBON; CARBOXYLATION; CURING; ELECTRIC CONDUCTIVITY; FILLED POLYMERS; PACKAGING MATERIALS; RAMAN SCATTERING; RAMAN SPECTROSCOPY; SILVER;

AMORPHOUS CARBON LAYER; CONDUCTIVE ADHESIVE; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTANCES; ENHANCED RAMAN SCATTERING; SURFACE ADSORBATES; SURFACE ENHANCED RAMAN SCATTERING (SERS); THERMAL CURING;

SURFACE SCATTERING;

EID: 84949933650     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990376     Document Type: Conference Paper

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