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Volumn 1, Issue 3, 1998, Pages 177-185
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Factors that influence the electrical contact resistance of isotropic conductive adhesive joints during climate chamber testing
a
a
TNO
(Netherlands)
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Author keywords
[No Author keywords available]
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Indexed keywords
ATMOSPHERIC HUMIDITY;
COPPER;
CURING;
ELECTRIC CONTACTS;
ELECTRIC RESISTANCE;
HIGH TEMPERATURE OPERATIONS;
LEAD;
METALLIZING;
PRINTED CIRCUIT BOARDS;
TIN;
CLIMATE CHAMBER TESTING;
ISOTROPIC CONDUCTIVE ADHESIVE (ICA) JOINTS;
ADHESIVE JOINTS;
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EID: 0032289895
PISSN: 10236228
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (10)
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References (9)
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