Reliability of electrically conductive adhesives

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 144-150

  Kudtarkar, Santosh Anil ^a   Morris, James E ^b  

^a State University of New York at Binghamton   (United States)

^b Portland State University   (United States)

Author keywords

Conductive adhesive; ICA; Reliability

Indexed keywords

CORROSION; CURING; INDEPENDENT COMPONENT ANALYSIS; RELIABILITY; SILVER;

CONDUCTIVE ADHESIVE; CU METALLIZATION; DROP-TEST PERFORMANCE; ELECTRICALLY CONDUCTIVE ADHESIVES; GALVANIC CORROSION; HUMIDITY TESTS; RELIABILITY TEST;

PACKAGING MATERIALS;

EID: 84949962886     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990378     Document Type: Conference Paper

References (7)

1. M.G. Perichaud, J.Y. Deletage, H. Fremont & Y. Danto, Microelectronics Reliability, September, 2000.
2. st International Conference on Polymers & Adhesives in Microelectronics & Photonics (Polytronic), Potsdam, 2001, pp. 61-69.
3. W.W. Wendlandt, P.K. Gallaghet & R.B. Prime, in Thermal Characterization of polymeric materials, E.A. Turi editor, Academic Press, New York, 1981.
4. nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, 1996, pp. 333-340.
5. U.R. Evans, "The Corrosion and Oxidation of metals: Scientific Principles and Practical Applications," Edward Arnold Ltd, London, 1960.
6. D. Lu, Q.K. Tong & C-P. Wong, IEEE Trans. Electronics Packaging Manufacturing, 22(3) July 1999, pp. 228-232.
7. R. Manepelli, F. Stepniak, S.A. Bistrup-Allen & P.A. Kohl, IEEE Trans. Advanced Packaging, 22(1) February 1999, pp. 4-8.