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Volumn 1998-September, Issue , 1998, Pages 55-61

Thermomechanical behaviour of adhesive jointed SMT components

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; JOINING; SURFACE MOUNT TECHNOLOGY;

EID: 84904078600     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742003     Document Type: Conference Paper
Times cited : (17)

References (11)
  • 1
    • 0029250245 scopus 로고
    • Assembly with conductive adhesives
    • February
    • "Assembly with conductive adhesives", K. Gilleo, Soldering and Surface Mount Technology, no 19, pp. 12-17, February 1995.
    • (1995) Soldering and Surface Mount Technology , Issue.19 , pp. 12-17
    • Gilleo, K.1
  • 2
    • 0029457357 scopus 로고
    • Test methodologies for characterization of die bond adhesives for non-hermetic packaging
    • "Test methodologies for characterization of die bond adhesives for non-hermetic packaging", R. Warren, D. Derfelt, C.E. Hoge, IEPS Conference, pp. 267-278 1995.
    • (1995) IEPS Conference , pp. 267-278
    • Warren, R.1    Derfelt, D.2    Hoge, C.E.3
  • 4
    • 0003049188 scopus 로고    scopus 로고
    • An innovation in thermoplastic, re workable adhesive pastes
    • January
    • "An innovation in thermoplastic, re workable adhesive pastes", R. Dietz, D. Peck, Microelectronics International, no 39, pp. 52-56, January 1996.
    • (1996) Microelectronics International , Issue.39 , pp. 52-56
    • Dietz, R.1    Peck, D.2
  • 6
    • 0010582093 scopus 로고
    • Electroconductive adhesives: Comparison of three different polymer matrices: Epoxy, Polyimide and Silicone
    • "Electroconductive adhesives: Comparison of three different polymer matrices: Epoxy, Polyimide and Silicone", J.M. Pujol, C. Prud'Homme, M.E. Quennesson, R. Cassat, Journal of Adhesion, vol 27, pp. 213-229 1989.
    • (1989) Journal of Adhesion , vol.27 , pp. 213-229
    • Pujol, J.M.1    Prud'Homme, C.2    Quennesson, M.E.3    Cassat, R.4
  • 7
    • 0342570800 scopus 로고    scopus 로고
    • Surface characteristics, reliability and failure mechanisms of Tin, Copper and Gold metallisations
    • Stockholm
    • "Surface characteristics, reliability and failure mechanisms of Tin, Copper and Gold metallisations", J. Liu, K. Gustafsson, Z. Lai, C. Li, Adhesives in Electronics'96, Stockholm, pp. l41-153 1996.
    • (1996) Adhesives in Electronics'96 , pp. l41-153
    • Liu, J.1    Gustafsson, K.2    Lai, Z.3    Li, C.4
  • 10
    • 0030104082 scopus 로고    scopus 로고
    • Finite-element simulation of a new two-dissipative mechanisms model for bulk medium-density polyethylene
    • "Finite-element simulation of a new two-dissipative mechanisms model for bulk medium-density polyethylene", J. Kichenin, K. Dang Van, K. Boytard, Journal of materials science 31, pp. 1653-1661, 1996, .
    • (1996) Journal of Materials Science , vol.31 , pp. 1653-1661
    • Kichenin, J.1    Van Dang, K.2    Boytard, K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.