Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Journal of Electronic Materials

Volumn 34, Issue 2, 2005, Pages 168-175

  Moon, Kyoung Sik ^a   Dong, Hai ^b   Maric, Radenka ^b   Pothukuchi, Suresh ^a   Hunt, Andrew ^b   Li, Y I ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

^b nGimat Co   (United States)

Author keywords

Low temperature interconnect; Melting point depression; Silver nanoparticles; Sintering; Thermal behavior

Indexed keywords

CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; NANOSTRUCTURED MATERIALS; OPTICAL INTERCONNECTS; SINTERING; THERMOANALYSIS; THERMOGRAVIMETRIC ANALYSIS;

LOW-TEMPERATURE INTERCONNECTS; MELTING POINT DEPRESSION; SILVER NANOPARTICLES; THERMAL BEHAVIOR;

SILVER;

EID: 14644401074     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0229-8     Document Type: Article

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