Polypyrrole as an interlay er for bonding conductive adhesives to activated aluminum bond pads

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 9-13

  Kuechenmeister, Frank ^a   Meusel, Ekkehard ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Bond pad treatment; Conductive adhesive; Polypyrrole

Indexed keywords

ALUMINUM; BONDING; CHARACTERIZATION; CHEMICAL ACTIVATION; CONDUCTIVE PLASTICS; COST EFFECTIVENESS; DEPOSITION; ELECTRIC VARIABLES MEASUREMENT; OPTIMIZATION; PHYSICAL PROPERTIES; PLASTIC ADHESIVES; X RAY SPECTROSCOPY;

ALUMINUM BOND PADS; CONDUCTIVE ADHESIVES; INTERLAYER; OPTICAL FABRICATION; POLYMERIC ELECTRONIC PACKAGING; POLYPYRROLE;

ELECTRONICS PACKAGING;

EID: 0031094211     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.558538     Document Type: Article

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