Physics and tribology of chemical mechanical planarization

Journal of Physics Condensed Matter

Volumn 20, Issue 22, 2008, Pages

  Kasai, Toshi ^a   Bhushan, Bharat ^b  

^a CABOT MICROELECTRONICS CORPORATION   (United States)

^b OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CONDENSED MATTER PHYSICS; KINEMATICS; MEMS; NEMS; SCANNING PROBE MICROSCOPY; TRIBOLOGY;

LUBRICATION REGIMES; POLISHING PAD INTERFACE;

CHEMICAL MECHANICAL POLISHING;

EID: 44449140080     PISSN: 09538984     EISSN: 1361648X     Source Type: Journal    
DOI: 10.1088/0953-8984/20/22/225011     Document Type: Article

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