A new approach for the study of chemical mechanical polishing

Electrochemical and Solid-State Letters

Volumn 3, Issue 2, 2000, Pages 90-92

  Devecchio, D ^a   Schmutz, P ^a   Frankel, G S ^a  

^a Ohio State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ATOMIC FORCE MICROSCOPY; BORON COMPOUNDS; COMPUTER SIMULATION; DISSOLUTION; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; PH EFFECTS; SILICA; SULFUR COMPOUNDS; SURFACE ROUGHNESS; SURFACE TOPOGRAPHY;

BORATE; CHEMICAL MECHANICAL POLISHING; MERCUROUS SULFATE ELECTRODE; SULFATE;

CHEMICAL POLISHING;

EID: 0034141093     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390967     Document Type: Article

References (5)

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2. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Platiarization of Microelectronic Materials, John Wiley & Sons, Inc., New York (1997).
3. L. Chen and D. Guay, J. Eleclrochem. Soc., 141, L43 (1994).
4. L. Roue, L. Chen, and D. Guay, Langmuir, 12, 5818 (1996).
5. P. Schmutz and G. S. Frankel, J. Electrochem. Soc.. 145, 2295 (1998).