In situ measurement of pressure and friction during CMP of contoured wafers

Journal of the Electrochemical Society

Volumn 152, Issue 6, 2005, Pages

  Scarfo, A M ^a   Manno, V P ^a   Rogers, C B ^a   Anjur, S P ^b   Moinpour, M ^c  

^a Tufts University   (United States)

^b CABOT MICROELECTRONICS CORPORATION   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA REDUCTION; FLUORESCENCE; FRICTION; HYDRODYNAMICS; LUBRICANTS; PRESSURE EFFECTS; SEMICONDUCTOR DEVICE MANUFACTURE;

CONTOURED WAFERS; CONVEX WAFERS; SLURRY FILM; WAFER SHAPE;

SILICON WAFERS;

EID: 22544470305     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1904923     Document Type: Article

References (6)

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6. A. M. Scarfo, M.S. Thesis, Tufts University (2003).