A locally relevant prestonian model for wafer polishing

Journal of the Electrochemical Society

Volumn 150, Issue 2, 2003, Pages

  Castillo Mejia, Danilo ^a   Beaudoin, Stephen ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; KINEMATICS; STRESS ANALYSIS; WSI CIRCUITS;

WAFER-SCALE PLANARIZATION;

CHEMICAL MECHANICAL POLISHING;

EID: 0037328946     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1532330     Document Type: Article

References (42)

1. V. H. Nguyen, A. J. Hof, H. van Kranenburg, P. H. Woerlee, and F. Weimar, Microelectron. Eng., 55, 305 (2001).
2. J. Tichy, J. A. Levert, L. Shan, and S. Danyluk, J. Electrochem. Soc., 146, 1523 (1999).
3. J. Steigerwald, S. Murarka, and R. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, J. Wiley, New York (1997).
4. F. W. Preston, J. Soc. Glass Technol., 11, 214 (1927).
5. Q. Luo, S. Ramajaran, and S. V. Babu, Thin Solid Films, 355, 160 (1998).
6. W.-T. Tseng and Y.-L. Wang, J. Electrochem. Soc., 144, L15 (1997).
7. F. G. Shi and B. Zhao, Appl. Phys. A: Mater. Sci. Process., 249, 67 (1998).
8. B. Zhao and F. G. Shi, Electrochem. Solid-State Lett., 2, 145 (1999).
9. H. Hocheng, H. Y. Tsai, and Y. T. Su, J. Electrochem. Soc., 148, G581 (2001).
10. W.-T. Tsai and T.-M. Huang, Thin Solid Films, 379, 107 (2000).
11. P. Wrschka, J. Hernandez, Y. Hsu, T. S. Kuan, G. S. Oehrlein, H. J. Sun, D. A. Hansen, J. King, and M. A. Fury, J. Electrochem. Soc., 146, 2689 (1999).
12. S. R. Runnels, I. Kim, J. Schleuter, C. Karlsrud, and M. Desai, IEEE Trans. Semi-cond. Manuf., 11, 501 (1998).
13. G. Nanz and L. E. Camilletti, IEEE Trans. Semicond. Manuf., 4, 382 (1995).
14. C.-H. Cho, S.-S. Park, and Y. Ahn, Thin Solid Films, 389, 254 (2001).
15. W.-T. Tseng, J.-H. Chin, and L.-C. Kang, J. Electrochem. Soc., 146, 1952 (1999).
16. F. Zhang and A. Busnaina, Electrochem. Solid-State Lett., 1, 184 (1998).
17. T. Bibby, Personal Communication, SpeedFam-IPEC (1998).
18. W. J. Patrick, W. L. Guttrie, C. L. Standey, and P. M. Schiable, J. Electrochem. Soc., 138, 1778 (1991).
19. W.-T. Tseng, J.-H. Chin, and L.-C. Kang, J. Electrochem. Soc., 146, 1952 (1999).
20. H. Hocheng, H. Y. Tsai, and M. S. Tsai, Int. J. Mach. Tools Manuf., 40, 1651 (2000).
21. K. L. Johnson, Contact Mechanics, p. 35, Cambridge University Press, New York (1985).
22. D. Wang, A. Zutshi, T. Bibby, S. P. Beaudoin, and T. S. Cale, Thin Solid Films, 345, 278 (1999).
23. D. Castillo, A. Perlov, and S. Beaudoin, J. Electrochem. Soc., 147, 4671 (2000).
24. D. Castillo, S. Gold, V. Burrows, and S. Beaudoin, J. Electrochem. Soc. 150, G76 (2003).
25. J. Levert, Ph.D. Dissertation, Georgia Institute of Technology, Atlanta, GA (1995).
26. B. Linford, Personal Communication, Rodel (2001).
27. L. M. Cook, J. Non-Cryst. Solids, 152, 120 (1990).
28. L. Borucki, Personal Communication, Motorola (2000).
29. E. Chagarov, Personal Communication, Arizona State University (2001).
30. T.-C. Tsai, P.-H. Lo, F.-L. Juang, C. Chang, C.-L. Lee, E. Hsu, and L.-M. Liu, Abstract 1246, The Electrochemical Society and The Electrochemical Society of Japan Meeting Abstracts, Vol. 99-2, Honolulu, HI, Oct 17-22, 1999.
31. D. Castillo, Unpublished data (2001).
32. D. J. Stein, D. L. Hetherington, and J. L. Cecchi, J. Electrochem. Soc., 146, 376 (1999).
33. D. Castillo, Unpublished Data (2001).
34. F. Sugimoto, Y. Arimoto, and T. Ito, Jpn. J. Appl. Phys., Part 1, 34, 6314 (1995).
35. S. Pang and A. Fuchs, Personal Communication, University of Nevada-Reno (2001).
36. K. Wijekoon, S. Tsai, D. Bennett, and F. Redeker, Abstract 1221, The Electro-chemical Society and The Electrochemical Society of Japan Meeting Abstracts, Vol. 99-2, Honolulu, HI, Oct 17-22, 1999.
37. H. Hocheng, Y.-L. Huang, and L.-J. Chen, J. Electrochem. Soc., 146, 4236 (1999).
38. Y. L. Wang, J. Wu, W. Liu, and J. Dun, Thin Solid Films, 332, 397 (1998).
39. H.-S. Kuo and W.-T. Tsai, Mater. Chem. Phys., 69, 53 (2001).
40. D. J. Stein, D. L. Hetherington, and J. L. Cecchi, J. Electrochem. Soc., 146, 1934 (1999).
41. S. P. Murarka and S. W. Hymes, Crit. Rev. Solid State Mater. Sci., 20, 87 (1995).
42. H. S. Fogler, Elements of Chemical Reaction Engineering, 2nd ed., p. 62, Prentice-Hall, NJ (1992).