Frictional behavior and particle adhesion of abrasive particles during Cu CMP

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 123-128

  Hong, Yi Koan ^a   Han, Ja Hyung ^a   Song, Jae Hoon ^a   Park, Jin Goo ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ADHESION; ADSORPTION; CONTAMINATION; COPPER; SILICON WAFERS;

CITRATE IONS; CITRIC ACID; FRICTION BEHAVIOR;

CHEMICAL MECHANICAL POLISHING;

EID: 30544433075     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-867-w6.2     Document Type: Conference Paper

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