Multi-scale physical CMP simulation framework for ECAD

2006 Proceedings - 11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006

Volumn , Issue , 2006, Pages 233-242

  Yoshida, Takafumi ^a  

^a YNT jpCom   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CELL-BASED; CHEMICAL-MECHANICAL PLANARIZATION; COMPUTATIONAL INTENSITY; DEVICE DESIGN; FIELD MATRIXES; PERIODIC PATTERN; PHYSICAL MODEL; SIMULATION FRAMEWORK;

BOUNDARY ELEMENT METHOD; COMPUTER AIDED DESIGN; ULSI CIRCUITS;

CHEMICAL MECHANICAL POLISHING;

EID: 84888266180     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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