Atomistic mechanisms underlying chemical mechanical planarization of copper

Materials Research Society Symposium - Proceedings

Volumn 767, Issue , 2003, Pages 57-62

  Ye, Y Y ^a,b   Biswas, R ^a   Bastawros, A ^a   Chandra, A ^a  

^a Iowa State University of Science and Technology   (United States)

^b WUHAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DISLOCATIONS (CRYSTALS); ETCHING; FRICTION; MOLECULAR DYNAMICS; NANOTECHNOLOGY;

EMBEDDED ATOM MODELS;

CHEMICAL MECHANICAL POLISHING;

EID: 0242322631     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-767-f1.8     Document Type: Conference Paper

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