Analytical dishing and step height reduction model for CMP with a viscoelastic pad

Journal of the Electrochemical Society

Volumn 151, Issue 9, 2004, Pages

  Guo, Yongjin ^a,b   Chandra, Abhijit ^a   Bastawros, Ashraf F ^a  

^a Iowa State University of Science and Technology   (United States)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFORMATION; HIGH PRESSURE EFFECTS; INTERFACES (MATERIALS); ITERATIVE METHODS; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; REDUCTION; RELAXATION PROCESSES; STRESS ANALYSIS; VISCOELASTICITY;

CHEMICAL MECHANICAL PLANARIZATION (CMP); PRESTON EQUATION; STEP HEIGHT REDUCTION MODEL; VISCOELASTIC PADS;

CHEMICAL MECHANICAL POLISHING;

EID: 4944257242     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1774189     Document Type: Article

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