A tribochemical study of ceria-silica interactions for CMP

Journal of the Electrochemical Society

Volumn 153, Issue 11, 2006, Pages

  Abiade, Jeremiah T ^a,b,c   Yeruva, Suresh ^a,b   Choi, Wonseop ^a,b   Moudgil, Brij M ^a,b   Kumar, Dhananjay ^c   Singh, Rajiv K ^a,b,d  

^a Department of Materials Science and Engineering ^*  (United States)

^b Particle Engineering Research Center   (United States)

^c North Carolina Agricultural and Technical State University   (United States)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CERIA SLURRIES; CERIA-SILICA POLISHING; FRICTION FORCE MEASUREMENTS;

ABRASION; ATOMIC FORCE MICROSCOPY; CERIUM; FORCE MEASUREMENT; HYDROLYSIS; PH EFFECTS; SILICA; SLURRIES; TRIBOLOGY;

CHEMICAL MECHANICAL POLISHING;

EID: 33749612193     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2349357     Document Type: Article

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