Effect of hydrogen peroxide on oxidation of copper in CMP slurries containing glycine

Journal of the Electrochemical Society

Volumn 150, Issue 11, 2003, Pages

  Aksu, Serdar ^a   Wang, Ling ^a   Doyle, Fiona M ^a  

^a Lawrence Berkeley National Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMINO ACIDS; CHEMICAL MECHANICAL POLISHING; COMPOSITION EFFECTS; DISSOLUTION; ELECTROCHEMISTRY; HYDROGEN PEROXIDE; OXIDATION; PASSIVATION; PH EFFECTS; SLURRIES;

COPPER WATER GLYCINE SYSTEMS; GLYCINE;

COPPER;

EID: 0242425781     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1615611     Document Type: Article

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