Wafer-bending measurements in CMP

Journal of the Electrochemical Society

Volumn 151, Issue 12, 2004, Pages

  Ng, Sum Huan ^a   Yoon, Inho ^a   Higgs III, C Fred ^a   Danyluk, Steven ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LOADS (FORCES); MATHEMATICAL MODELS; SILICON WAFERS; STRESSES;

CARRIER FILMS; FLUID PRESSURE; POLISHING PADS; STATIC LOADING;

CHEMICAL MECHANICAL POLISHING;

EID: 10844286474     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1809581     Document Type: Article

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