Contact mechanics and lubrication hydrodynamics of chemical mechanical polishing

Journal of the Electrochemical Society

Volumn 146, Issue 4, 1999, Pages 1523-1528

  Tichy, John ^a   Levert, Joseph A ^b   Shan, Lei ^b   Danyluk, Steven ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACTS (FLUID MECHANICS); DRAG; ELASTOHYDRODYNAMIC LUBRICATION; GEOMETRY; INTERFACES (MATERIALS); LOADS (FORCES); MATHEMATICAL MODELS; PRESSURE; SILICON WAFERS; SLURRIES; SPEED; SURFACE ROUGHNESS;

AD HOC ASSUMPTIONS; CHEMICAL MECHANICAL POLISHING; PAD DEFLECTION; PAD WAFER INTERACTION; SUCTION FLUID PRESSURE;

ELECTROLYTIC POLISHING;

EID: 0032661328     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391798     Document Type: Article

References (9)

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8. A. E. Green and P. M. Naghdi, Acta Mechanica, 329 (1970).
9. N. Patir and H. S. Cheng, ASME J. Lubrication Technol., 100, 12 (1978).