In situ AFM study of surface layer removal during copper CMP

Electrochemical and Solid-State Letters

Volumn 6, Issue 7, 2003, Pages

  Berdyyeva, T K ^a   Emery, S B ^a   Sokolov, I Yu ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; PH EFFECTS; SCANNING;

SURFACE LAYERS;

COPPER;

EID: 0038167577     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1576051     Document Type: Article

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