In situ technique for dynamic fluid film pressure measurement during chemical mechanical polishing

Journal of the Electrochemical Society

Volumn 147, Issue 7, 2000, Pages 2741-2743

  Bullen, David ^a   Scarfo, Alicia ^b   Koch, Alia ^b   Bramono, Dewi P Y ^b   Coppeta, Jonathan ^b   Racz, Livia ^b  

^a Engineering Research Center and Hydraulics Laboratory   (United States)

^b Tufts University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRESSURE DISTRIBUTION; PRESSURE MEASUREMENT; SILICON WAFERS;

CHEMICAL MECHANICAL POLISHING (CMP);

CHEMICAL POLISHING;

EID: 0034224098     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393598     Document Type: Article

References (7)

1. J. Coppeta, Ph.D. Thesis, Tufts University, Medford, MA (1999).
2. J. Levert, F. Mess, L. Grote, M. Dmytrychenko, L. Cook, and S. Danyluk, in Slurry Film Thickness Measurements in Float, Semi-Permeable, and Permeable Polishing Pad Geometries, Proceedings of the International Tribology Conference, Yokohama, Japan (1995).
3. J. Tichy, J. Levert, L. Shan, and S. Danyluk, J. Electrochem. Soc., 146, 1523 (1999).
4. D. P. Bramono, M.S. Thesis, Tufts University, Medford, MA (1999).
5. S. Sundararajan, D. Thakurta, D. Schwendeman, S. Murarka, and W. Gill, J. Electrochem. Soc., 146, 761 (1999).
6. W. Tseng, J. Chin, and L. Kang, J. Electrochem. Soc., 146, 1952 (1999).
7. R. Subramanian, L. Zhang, and S. Babu, J. Electrochem. Soc., 146, 4263 (1999).