Pad conditioning and pad surface characterization in oxide chemical mechanical polishing

Materials Research Society Symposium Proceedings

Volumn 732, Issue , 2002, Pages 114-119

  Lawing, A Scott ^a  

^a Rodel Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; INTERFEROMETRY; PARAMETER EXTRACTION;

PAD CONDITIONING; VERTICAL SCANNING INTERFEROMETRY;

SURFACE ANALYSIS;

EID: 34249874061     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-732-i5.3     Document Type: Conference Paper

References (13)

1. T.K. Yu, C.C. Yu and M. Orlowski, Proceedings of the 1993 International Electron Devices Meeting, p 35.4.1, (1994).
2. D. Stein, D. Hetherington, M. Dugger and T. Stout, Journal of Electronic Materials, Vol. 25, No. 10, 1623-1627, (1996).
3. A.R. Baker, Proceedings of the Second International Chemical Mechanical Planarization for VLSI/ULSI Interconnection Conference (CMP-MIC), San Jose CA, 339-342, (1997).
4. L. Shan, Mechanical Interactions at the Interface of Chemical Mechanical Polishing, PhD Thesis, Georgia Institute of Technology, Chapter 4, (2000).
5. A.S. Lawing, Proceedings of the Seventh International Chemical Mechanical Planarization for VLSI/ULSI Interconnection Conference (CMP-MIC), San Jose CA, Feb. 27-March I, 310-317, (2002).
6. A.S. Lawing, Proceedings of the Fifth International Symposium on Chemical Mechanical Planarization, Philadelphia, PA, May 12-17, (2002).
7. M.R. Oliver, R.E. Schmidt and M. Robinson, Proceedings of the Fourth International Symposium on Chemical Mechanical Planarization, 77-83, (2000).
8. L. Borucki, submitted to Journal of Engineering Mathematics
9. L. Borucki, private communication.
10. H-j Kim, D-h Kim and H-d Jeong, Proceedings of the Seventh International Chemical Mechanical Planarization for VLSI/ULSI Interconnection Conference (CMP-MIC), San Jose CA, Feb. 27-March 1, 201-208, (2002).
11. A.R, Baker, Proceedings of the Semicon West CMP Symposium, San Francisco, CA (1998).
12. D. Castillo-Mejia, V. Burrows and S. Beaudoin, Submitted to Journal of the Electrochemical Society.
13. A.S. Lawing and T. Merchant, Proceedings of the Fourth International Symposium on Chemical Mechanical Planarization, 129-140, (2000).