Ultraprecision grinding technologies in silicon semiconductor processing

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Volumn 218, Issue 3, 2004, Pages 253-267

  Ahearne, E ^a   Byrne, G ^a  

^a UNIVERSITY COLLEGE DUBLIN   (Ireland)

Author keywords

Grinding; Semiconductor; Silicon; Surface grinding; Ultraprecision

Indexed keywords

GRINDING (COMMINUTION); INTEGRATED CIRCUITS; MACHINE TOOLS; MICROPROCESSOR CHIPS; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

SILICON SEMICONDUCTOR PROCESSING; SURFACE GENERATION; SURFACE GRINDING; ULTRAPRECISION GRINDING TECHNOLOGIES;

SILICON;

EID: 26244435443     PISSN: 09544054     EISSN: 09544054     Source Type: Journal    
DOI: 10.1243/095440504322984812     Document Type: Conference Paper

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