-
1
-
-
21644481983
-
Implant Damage and Gate-Oxide-Edge Effects on Product Reliability
-
Y.-H. Lee et al., "Implant Damage and Gate-Oxide-Edge Effects on Product Reliability" IEDM Tech. Dig., 2004, pp. 481-484.
-
(2004)
IEDM Tech. Dig
, pp. 481-484
-
-
Lee, Y.-H.1
-
2
-
-
0031380178
-
Degradation of the characteristics of p+ poly MOS Capacitors with NO Nitrided Gate Oxide Due to Post Nitrogen Annealing
-
M. K. Mazumder et al., "Degradation of the characteristics of p+ poly MOS Capacitors with NO Nitrided Gate Oxide Due to Post Nitrogen Annealing" IEEE/IRW Final Report 1997, pp. 142-143
-
IEEE/IRW Final Report 1997
, pp. 142-143
-
-
Mazumder, M.K.1
-
3
-
-
0033723854
-
-
C-H. Huang et al., Enhancement in soft breakdown occurrence of ultra-thin gate oxides caused by phonon effect in rapid thermal post-oxidation annealing Solid State Elec. 2000, 44; pp. 1405-1409
-
C-H. Huang et al., Enhancement in soft breakdown occurrence of ultra-thin gate oxides caused by phonon effect in rapid thermal post-oxidation annealing" Solid State Elec. 2000, 44; pp. 1405-1409
-
-
-
-
4
-
-
0035416629
-
Comparison of leakage currents induced by ion implantation and high field electric stress
-
D. Gouenheim et al., "Comparison of leakage currents induced by ion implantation and high field electric stress" Solid State elctron. 2001, 45, pp. 1355-1360
-
(2001)
Solid State elctron
, vol.45
, pp. 1355-1360
-
-
Gouenheim, D.1
-
5
-
-
78651574771
-
Gate Oxide Damage and Charging Characterization in a 0.13mm, Triple Oxide (1.7/2.2/5.2 nm) Bulk Technology
-
T. B. Hook et al., "Gate Oxide Damage and Charging Characterization in a 0.13mm, Triple Oxide (1.7/2.2/5.2 nm) Bulk Technology" IEEE/Int. Symp. Plasma- and Process-Induced Damage, 2002, pp. 10-13
-
(2002)
IEEE/Int. Symp. Plasma- and Process-Induced Damage
, pp. 10-13
-
-
Hook, T.B.1
-
6
-
-
0034512993
-
Dual Gate Oxide Charging Damage in Damascene Copper Technologies
-
A. K. Stamper et al., "Dual Gate Oxide Charging Damage in Damascene Copper Technologies" IEEE/Int. Symp. Plasma- and Process-Induced Damage, 2001), pp. 109-112
-
(2001)
IEEE/Int. Symp. Plasma- and Process-Induced Damage
, pp. 109-112
-
-
Stamper, A.K.1
-
7
-
-
21644434885
-
New insight into gate dielectric breakdown induced MOSFET degradation by novel percolation path resistance measurements
-
IEDM Teen. Dig
-
K. L. Pey et al., "New insight into gate dielectric breakdown induced MOSFET degradation by novel percolation path resistance measurements'' IEDM Teen. Dig., 2004. pp. 717-710
-
(2004)
, pp. 717-710
-
-
Pey, K.L.1
-
8
-
-
33747905416
-
-
R. Degraeve et al., Relation between breakdown mode and location in short-channel NMOSFETs and its impact on reliability specificationsIEEE/ Dev. Mat. Reliab. 2001, 1, pp. 163-169
-
R. Degraeve et al., "Relation between breakdown mode and location in short-channel NMOSFETs and its impact on reliability specifications"IEEE/ Dev. Mat. Reliab. 2001, 1, pp. 163-169
-
-
-
-
9
-
-
0036494130
-
Consistent model for short-channel nMOSFET after hard gate oxide breakdown
-
B. Kaczer et al., "Consistent model for short-channel nMOSFET after hard gate oxide breakdown" Trans. on Elec. Dev. 2002, 49, pp. 507-513
-
(2002)
Trans. on Elec. Dev
, vol.49
, pp. 507-513
-
-
Kaczer, B.1
-
10
-
-
34250770179
-
-
M. A. Alam et al., Theory of Current-Ratio For Oxide Reliability: Proposal and Validation of a New Class Two-Dimensional Breakdown-Spot Characterization Techniques IEDM Tech. Dig. 2005, pp. f6.5-1-16.5.4
-
M. A. Alam et al., "Theory of "Current-Ratio" For Oxide Reliability: Proposal and Validation of a New Class Two-Dimensional Breakdown-Spot Characterization Techniques" IEDM Tech. Dig. 2005, pp. f6.5-1-16.5.4
-
-
-
-
11
-
-
0033741526
-
Detection of Thin Oxide (3.5nm) Dielectric Degradation due to Charging Damage oy Rapid-Ramp Breakdown
-
T. B. Hook et al., "Detection of Thin Oxide (3.5nm) Dielectric Degradation due to Charging Damage oy Rapid-Ramp Breakdown" IEEE/IRPS, 2000, pp. 377-388
-
(2000)
IEEE/IRPS
, pp. 377-388
-
-
Hook, T.B.1
-
12
-
-
0028539731
-
An Efficient Method For Plasma-Charging Damage Measurement
-
K. P. Cheung, "An Efficient Method For Plasma-Charging Damage Measurement" Elec. Dev. Lett. 1994, pp. 460-462
-
(1994)
Elec. Dev. Lett
, pp. 460-462
-
-
Cheung, K.P.1
-
14
-
-
0033282869
-
Detecting breakdown in ultra-thin dielectrics using a fast voltage ramp
-
Synoer et al., "Detecting breakdown in ultra-thin dielectrics using a fast voltage ramp" IRW Final Report 1999, pp. 118-123
-
IRW Final Report 1999
, pp. 118-123
-
-
Synoer1
-
15
-
-
0032689171
-
Time dependent dielectric wearout (TDDW) technique for reliability of ultrathin gate oxides
-
Y. Wu et al., "Time dependent dielectric wearout (TDDW) technique for reliability of ultrathin gate oxides" Elec. Dev. Lett. 1999, 20, pp. 262-264
-
(1999)
Elec. Dev. Lett
, vol.20
, pp. 262-264
-
-
Wu, Y.1
-
16
-
-
0032661176
-
Influence of Soft Breakdown on NMOSFET Device Characteristics
-
Pompl et al., "Influence of Soft Breakdown on NMOSFET Device Characteristics" IEEE/IRPS 1999, pp. 82-87
-
(1999)
IEEE/IRPS
, pp. 82-87
-
-
Pompl1
-
17
-
-
85066230299
-
Impact of MOS Technological Parameters on the Detection and Modeling of the Soft Breakdown
-
E. Miranda et al., "Impact of MOS Technological Parameters on the Detection and Modeling of the Soft Breakdown" IEEE/Int. Conf. Micorelec. 2000, pp. 327-330
-
(2000)
IEEE/Int. Conf. Micorelec
, pp. 327-330
-
-
Miranda, E.1
-
19
-
-
0036931973
-
A New Model of Time Evolution of Gate Leakage Current after Soft Breakdown in Ultra-thin Gate Oxides
-
T. Hosoi et al., "A New Model of Time Evolution of Gate Leakage Current after Soft Breakdown in Ultra-thin Gate Oxides" IEDM Tech. Dig., 2002 pp. 155-158
-
(2002)
IEDM Tech. Dig
, pp. 155-158
-
-
Hosoi, T.1
-
20
-
-
34250721804
-
Evidence for defect-generation-driven wear-out of breakdown conduction path in ultra thin oxides
-
F. Monsieur et al., "Evidence for defect-generation-driven wear-out of breakdown conduction path in ultra thin oxides" IRW Final Report, 2002, pp. 1-8
-
(2002)
IRW Final Report
, pp. 1-8
-
-
Monsieur, F.1
-
21
-
-
0141452016
-
-
E. Miranda et al., Degradation Dynamics of Ultrathin Gate Oxides Subjected to Electrical Stress'' Elec. Dev. Lett. 2003, 24 pp. 604-606
-
E. Miranda et al., "Degradation Dynamics of Ultrathin Gate Oxides Subjected to Electrical Stress'' Elec. Dev. Lett. 2003, 24 pp. 604-606
-
-
-
-
22
-
-
34250748129
-
Progressive Breakdown Statics in Ultra-thin Silicon Dioxides
-
W. Y. Loh et al., "Progressive Breakdown Statics in Ultra-thin Silicon Dioxides" Proc. IPFA 2003, pp. 157-163
-
(2003)
Proc. IPFA
, pp. 157-163
-
-
Loh, W.Y.1
-
23
-
-
0038649017
-
Growth and Scaling of Oxide Conduction after Breakdown
-
B. P. Linder et al., "Growth and Scaling of Oxide Conduction after Breakdown" IEEE/IRPS,2003, pp. 402-405
-
(2003)
IEEE/IRPS
, pp. 402-405
-
-
Linder, B.P.1
-
24
-
-
3042652845
-
Acceleration Factors and Mechanistic Study of Progressive Breakdown in Small Area Ultra-Thin Gate Oxides
-
J. S. Suehle et al., "Acceleration Factors and Mechanistic Study of Progressive Breakdown in Small Area Ultra-Thin Gate Oxides IEEE/IRPS, 2004, pp. 95-101
-
(2004)
IEEE/IRPS
, pp. 95-101
-
-
Suehle, J.S.1
-
25
-
-
21644473075
-
Implication of progressive wear-out for lifetime extrapolation of ultra-thin (EOT ∼ 1 nm) SiON films
-
B. Kaczer et at., "Implication of progressive wear-out for lifetime extrapolation of ultra-thin (EOT ∼ 1 nm) SiON films" IEDM Tech. Dig., 2004, pp. 713-716
-
(2004)
IEDM Tech. Dig
, pp. 713-716
-
-
Kaczer, B.1
et at2
-
26
-
-
28744433576
-
-
V. L. Lo et al., Exponential dependence of percolation resistance on gate voltage and its impacts on progressive breakdown IEEE/IRPS, 2005, pp. 602-603
-
V. L. Lo et al., "Exponential dependence of percolation resistance on gate voltage and its impacts on progressive breakdown" IEEE/IRPS, 2005, pp. 602-603
-
-
-
-
27
-
-
3142703596
-
A New Model for the Breakdown Dynamics of Ultra-Thin Gate Oxides Based on the Stochastic Logistic Differential Wquation
-
E. Miranda et al., "A New Model for the Breakdown Dynamics of Ultra-Thin Gate Oxides Based on the Stochastic Logistic Differential Wquation" IEEE/Int. Conf. Microelec. 2004, pp. 625-628
-
(2004)
IEEE/Int. Conf. Microelec
, pp. 625-628
-
-
Miranda, E.1
-
28
-
-
3042520506
-
Stracture of The Breakdown Spot During Progressive Breakdown of Ultra-Thin Gate Oxides
-
F. Palumdo et al., "Stracture of The Breakdown Spot During Progressive Breakdown of Ultra-Thin Gate Oxides" IEEE/IRPS, 2004, pp. 583-584
-
(2004)
IEEE/IRPS
, pp. 583-584
-
-
Palumdo, F.1
-
29
-
-
14644432479
-
-
R. o Connor et al., Progressive breakdown in ultrathin SiON dielectrics and its effect on transistor performance Mic. Reliab. 2005, 45, pp. 869-874
-
R. o Connor et al., "Progressive breakdown in ultrathin SiON dielectrics and its effect on transistor performance" Mic. Reliab. 2005, 45, pp. 869-874
-
-
-
-
30
-
-
14644396609
-
Structure of the oxide damage under progressive breakdown
-
F. Palumbo et al., "Structure of the oxide damage under progressive breakdown" Mic. Reliab. 2005, 45, pp. 845-848
-
(2005)
Mic. Reliab
, vol.45
, pp. 845-848
-
-
Palumbo, F.1
-
31
-
-
0038516265
-
Methodology for Accurate C-V Measurement of Gate Insulators below 1.5 nm EOT
-
H. Suto et al., "Methodology for Accurate C-V Measurement of Gate Insulators below 1.5 nm EOT" Ext. Abst. Solid State Dev. and Mat. 2002, pp. 748-749
-
(2002)
Ext. Abst. Solid State Dev. and Mat
, pp. 748-749
-
-
Suto, H.1
-
32
-
-
0037966281
-
The Negative Capacitance Effect on the C-V measurement of Ultra Thin Gate Dielectrics Induced by the Stray Capacitance of the Measurement System
-
Y. Okawa et al., "The Negative Capacitance Effect on the C-V measurement of Ultra Thin Gate Dielectrics Induced by the Stray Capacitance of the Measurement System" IEEE/ICMTS, 2003, pp. 197-202
-
(2003)
IEEE/ICMTS
, pp. 197-202
-
-
Okawa, Y.1
-
33
-
-
0345201638
-
A Function-Fit Model for the Soft Breakdown Failure Mode
-
E. Miranda et el., "A Function-Fit Model for the Soft Breakdown Failure Mode" IEEE/Elec. Dev. Lett. 1999,20, pp. 265-267
-
(1999)
IEEE/Elec. Dev. Lett
, vol.20
, pp. 265-267
-
-
Miranda, E.1
el2
-
34
-
-
34250720201
-
-
2 gate oxides IEDM 2000, pp. 22.2.1-22.2-4
-
2 gate oxides" IEDM 2000, pp. 22.2.1-22.2-4
-
-
-
-
35
-
-
0040752625
-
Post-radiation-induced soft breakdown conduction properties as a function of temperature
-
A. Cester et al., "Post-radiation-induced soft breakdown conduction properties as a function of temperature" Appl. Phys. Lett. 2001, 79. pp. 1336-1338
-
(2001)
Appl. Phys. Lett
, vol.79
, pp. 1336-1338
-
-
Cester, A.1
-
36
-
-
0036535971
-
Transport characteristics of postfard breakdown thin silicon oxide films and consideration of physical models
-
Y. Omura et al., "Transport characteristics of postfard breakdown thin silicon oxide films and consideration of physical models" J. Appl. Phys. 2002, 91, pp. 4298-4306
-
(2002)
J. Appl. Phys
, vol.91
, pp. 4298-4306
-
-
Omura, Y.1
-
37
-
-
0000171167
-
Condction mechanism under quasibreakdown of ultrathin gate oxide
-
Y. D. He et al., "Condction mechanism under quasibreakdown of ultrathin gate oxide" Appl. Phys. Lett. 1999,75, pp. 2432-2434
-
(1999)
Appl. Phys. Lett
, vol.75
, pp. 2432-2434
-
-
He, Y.D.1
-
38
-
-
0000926071
-
An emoedded quantum wire model of dielectric oreakdcwn
-
D. Z.-Y. Ting. "An emoedded quantum wire model of dielectric oreakdcwn". Appl. Phys. Lett. 1999, 74, pp. 585-587
-
(1999)
Appl. Phys. Lett
, vol.74
, pp. 585-587
-
-
Ting, D.Z.-Y.1
-
39
-
-
0031674379
-
Switching behavior of the soft breakdown conduction characteristic in ultra-thin (<5 nm) oxide MOS capacitors
-
E. Miranda et al., "Switching behavior of the soft breakdown conduction characteristic in ultra-thin (<5 nm) oxide MOS capacitors" IEEE/IRPS, 1998, pp. 42-46
-
(1998)
IEEE/IRPS
, pp. 42-46
-
-
Miranda, E.1
-
40
-
-
0001004010
-
Model for the current-voltage characteristics of ultrathin gate oxides after soft breakdown
-
M. Houssa et al., "Model for the current-voltage characteristics of ultrathin gate oxides after soft breakdown" J. Appl. Phys. 1998, 84, pp.4351-4355
-
(1998)
J. Appl. Phys
, vol.84
, pp. 4351-4355
-
-
Houssa, M.1
-
41
-
-
0035018944
-
Analytic Modeling of Leakage Current Through Multiple Breakdown Paths in SiO2 Films
-
E. Miranda et al., "Analytic Modeling of Leakage Current Through Multiple Breakdown Paths in SiO2 Films" IEEE/IRPS 2001, pp. 367-379
-
(2001)
IEEE/IRPS
, pp. 367-379
-
-
Miranda, E.1
-
42
-
-
19944431600
-
Model for the voltage and temperature dependence of the soft breakdown current in ultrathin gate oxides
-
A. Avellán et al., "Model for the voltage and temperature dependence of the soft breakdown current in ultrathin gate oxides" J. Appl. Phys. 2005.97, pp. 14104-14108
-
(2005)
J. Appl. Phys
, vol.97
, pp. 14104-14108
-
-
Avellán, A.1
-
43
-
-
34250731431
-
-
A. Cester et al., A Novel Approach to Quantum Point Contact for post Soft Breakdown Conduction IEDM, 2001, pp. 13.6.1-13.64
-
A. Cester et al., A Novel Approach to Quantum Point Contact for post Soft Breakdown Conduction" IEDM, 2001, pp. 13.6.1-13.64
-
-
-
-
44
-
-
0346151210
-
Single-equation model for low and high voltage soft breakdown conduction
-
E. Miranda et el., "Single-equation model for low and high voltage soft breakdown conduction" Microelec. Reliab. 2004, 44, pp. 163-166
-
(2004)
Microelec. Reliab
, vol.44
, pp. 163-166
-
-
Miranda, E.1
el2
-
45
-
-
0037634404
-
Temperature dependence and conduction mechanism after Analog Soft Breakdown
-
T. Nigam et al., "Temperature dependence and conduction mechanism after Analog Soft Breakdown" IEEE/IRPS, 2003, pp. 417-423
-
(2003)
IEEE/IRPS
, pp. 417-423
-
-
Nigam, T.1
-
47
-
-
0033731780
-
Analysis of the Relationship Between Defect Site Generation and Dielectric Breakdown Utilizing A-Mode Stress Induces Leakage Current Trans. on Elec
-
K. Okada, Analysis of the Relationship Between Defect Site Generation and Dielectric Breakdown Utilizing A-Mode Stress Induces Leakage Current" Trans. on Elec. Dev. 2000, 47, pp. 1225-1230
-
(2000)
Dev
, vol.47
, pp. 1225-1230
-
-
Okada, K.1
-
48
-
-
84932160833
-
-
W. Lai et al., Impact of Stress Induced Leakage Current on Power-Consumption in Ultra-Thin Gate Oxides IEEE/IRPS 2004, pp. 102-109
-
W. Lai et al., "Impact of Stress Induced Leakage Current on Power-Consumption in Ultra-Thin Gate Oxides" IEEE/IRPS 2004, pp. 102-109
-
-
-
-
49
-
-
28744439037
-
Measurement and statistical analysis of single trap current-voltage characteristics in ultrathin SiON
-
R. Degraeve et al., "Measurement and statistical analysis of single trap current-voltage characteristics in ultrathin SiON" IEEE/IRPS 2005, pp. 360365
-
(2005)
IEEE/IRPS
, pp. 360365
-
-
Degraeve, R.1
-
50
-
-
0035339636
-
Anode hole injection, defect generation, and breakdown in ultrathin silicon dioxide films
-
D. J. DiMaria et al., "Anode hole injection, defect generation, and breakdown in ultrathin silicon dioxide films" J. Appl. Phys. 2001, 89, pp. 5015-5024
-
(2001)
J. Appl. Phys
, vol.89
, pp. 5015-5024
-
-
DiMaria, D.J.1
-
51
-
-
34250733133
-
Saturation Phenomenon of Stress Induced Gate Leakage Current
-
S. Ueno et al., "Saturation Phenomenon of Stress Induced Gate Leakage Current" Ext. Abst. Solid State Dev. and Mat. 2001 pp. 136-137
-
(2001)
Ext. Abst. Solid State Dev. and Mat
, pp. 136-137
-
-
Ueno, S.1
-
52
-
-
0032671788
-
A Model of the Stress Time Dependence of SILC
-
Q. Lu et al., "A Model of the Stress Time Dependence of SILC" IEEE/IRPS 1999, pp. 396-399
-
(1999)
IEEE/IRPS
, pp. 396-399
-
-
Lu, Q.1
-
53
-
-
0037818474
-
-
W. Y. Loh et al., Localized oxide degradation in ultrathin gate dielectric and its statistical analysis IEEE/Tran. Elec. Dev. 2003, 50, pp. 967-972
-
W. Y. Loh et al., Localized oxide degradation in ultrathin gate dielectric and its statistical analysis" IEEE/Tran. Elec. Dev. 2003, 50, pp. 967-972
-
-
-
-
54
-
-
34250696182
-
A new model for the breakdown dynamics of ultra-thin gate oxides based on the stochastic logistic differential equation
-
E. Miranda et al., "A new model for the breakdown dynamics of ultra-thin gate oxides based on the stochastic logistic differential equation" Int. Conf. Microelec. 2004, pp. 16-19
-
(2004)
Int. Conf. Microelec
, pp. 16-19
-
-
Miranda, E.1
|