A survey of automated material handling systems in 300-mm semiconductor fabs

IEEE Transactions on Semiconductor Manufacturing

Volumn 19, Issue 1, 2006, Pages 112-120

  Agrawal, Gaurav K ^a,b   Heragu, Sunderesh S ^a,c,d,e  

^a IEEE   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^c University of Louisville   (United States)

^d UNIVERSITY OF LOUISVILLE   (United States)

^e Institute of Industrial Engineers

Author keywords

300 mm semiconductor manufacturing; Automated material handling systems (AMHS); Fab layouts; Survey

Indexed keywords

AUTOMATED MATERIAL HANDLING SYSTEM (AMHS); FAB LAYOUTS;

AUTOMATION; MATERIALS HANDLING; SEMICONDUCTOR DEVICE MANUFACTURE;

SYSTEMS ANALYSIS;

EID: 33144486490     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2005.863217     Document Type: Conference Paper

References (65)

1. G. E. Moore, "Cramming more components onto integrated circuits," Electron., vol. 38, no. 8, Apr. 1965.
2. D. Seligson, "Planning for the 300 mm transition," Intel Technol, J., vol. Q3, 1998.
3. Sematech [Online]. Available: www.sematech.org
4. V. Bakshi, D. Youngson, and R. Goodall, "300 mm moves into the next century," Semiconduct. Int., vol. 22, no. 8, pp. 92-97, Jul. 1999.
5. B. Waterbury, "Wafer fabrication moves to open controls," Conn; Design, Feb. 2001.
6. T. M. Garrett, "Intel's 300, program is on-line," Electron. J., Apr. 2001.
7. D. Lammers, "U.S. companies move up to 300-mm wafer fabs," EE Times, Jul. 2002.
8. J. J. Plata, "300 mm fab design - A total factory perspective," in Proc. IEEE Int. Symp. Semiconductor Manufacturing Conf., Oct. 6-8, 1997, pp. A5-A8.
9. B. Sohn, D. Pillai, and N. Acker, "300 mm factory design for operational effectiveness," in Proc. Eur. IEEE/SEMI Semiconductor Manufacturing Conf., Apr. 2-3, 2000.
10. M. Chase, "300 mm begins full-fab automation challenges," Semiconduct. Int., p. 152, Jul. 2000.
11. M. Chase, D. Scott, and J. Nestel-Patt, "The challenges of macro integration for fully automated 300 mm fabs," Solid State Technol., pp. 52-64, Oct. 2000.
12. J. Ghiselli, "2001: The "make or break" year for 300 mm wafer transition goals," Solid State Technol., pp. 173-174, May 2001.
13. R. Hunter and C. Humphreys, "Trends in 300 mm factory automation," Semiconduct. Int., pp. 60-64, Jun. 2003.
14. S. A. Irani, H. Zhang, J. Zhou, H. Huang, T. K. Udai, and S. Subramanian, "Production flow analysis and simplification toolkit (PFAST)," Int. J. Prod. Res., vol. 38, no. 8, pp. 1855-1874, 2000.
15. C. D. Geiger, R. Hase, C. G. Takoudis, and R. Uzsoy, "Alternative facility layouts for semiconductor wafer fabrication facilities," IEEE Trans. Comput, Pack. Manufact. Technol, vol. 20, no. 2, part C, pp. 152-163, Apr. 1997.
16. K. Gartland and E. Sherwood, "Automation needs reach new levels," Semiconduct. Int., pp. 157-163, Jul. 2000.
17. M. Brain, "An automation route to upgrading fabs toward 300 mm," Solid State Technol., pp. 69-76, Oct. 2000.
18. D. Meyersdorf and A. Taghizadeh, "Fab layout design methodology: Case of the 300 mm fabs," Semiconduct. Int., vol. 22, no. 8, pp. 187-196, Jul. 1998.
19. J. Chrisos and J. Nestel-Patt, "Integration risk in 300-mm wafer fab automation," Solid State Technol, vol. 41, no. 7, p. 193, Jul. 1998.
20. F. Robertson and A. Allan, "300 mm conversion timing," Future Fab Mag. (Future Fab Int.), vol. Q2, 1997.
21. E. S. Meieran, "21st Century semiconductor manufacturing capabilities," Intel Technol. J., vol. Q4, 1998.
22. D. Pillai and T. Abell, "Accelerating 300 mm conversion using industry standards," in Proc. SEMICON Conf. Japan, Dec. 1, 1999.
23. S. S. Heragu, Facilities Design. Boston, MA: PWS, 1997.
24. M. J. Wang, H. C. Chung, and H. S. Wu, "The evaluation of manual FOUP handling in 300 mm wafer fab," IEEE Trans. Semiconduct. Manufact., vol. 16, no. 3, Aug. 2003.
25. K. Gartland, Automated Material Handling System (AMHS) Framework User Requirements Document: Version 1.0 International SEMATECH, Technol. Transfer # 99 073 793A-TR, 1999.
26. D. Pillai, "Material handling automation for wafer fabrication facilitites," in Proc. IEEE/CHMT '90 IEMT Symp., 1990.
27. D. Pillai and S. R. Srinivasan, "Material handling automation-Trends, vision, and future plans," in Proc. ISSM, Tokyo, Japan, 1996.
28. D. Pillai, T. Quinn, K. Kryder, and D. Charlson, "Integration of 300 mm fab layouts and material handling automation," in Proc. ISSM, Oct. 1999.
29. R. Wright, C. Cunningham, K. Benhayoune, E. Campbell, V. Swaminathan, and R. White, "300 mm factory layout and automated materials handling," Solid State Technol., pp. 35-42, Dec. 1999.
30. T. Yang and B. A. Peters, "A spine layout design method for semiconductor fabrication facilities containing automated material-handling systems," Int. J. Oper. Prod. Manage., vol. 17, no. 5, pp. 490-501, 1997.
31. B. A. Peters and T. Yang, "Integrated facility layout and material handling system design in semiconductor fabrication facilities," IEEE Trans. Semiconduct. Manufact., vol. 10, no. 3, pp. 360-369, Aug. 1997.
32. T. Yang, M. Rajasekharan, and B. A. Peters, "Semiconductor fabrication facility design using a hybrid search methodology," Commuters Indust. Eng., vol. 36, pp. 565-583, 1999.
33. R. D. Meiler, "The multi-bay manufacturing facility layout problem," Int. J. Prod. Res., vol. 35, no. 5, pp. 1229-1237, 1997.
34. S. Merchant and A. D. Chasey, "Impact of AMHS on design and construction of 300 mm fabs," Semiconduct. Fabtech.
35. D. Feindel and U. Kaempf, "The case for continuous flow transport of wafer carriers," Semiconduct. Int., pp. 299-308, Jul. 2000.
36. T. Arzt and F. Bulcke, "A new low cost approach in 200 mm and 300 mm AMHS," Semiconductor Fabtech 10th ed. pp. 19-26, 2000.
37. J. H. Ting and J. M. A. Tanchoco, "Unidirectional circular layout for overhead material handling systems," Int. J. Prod. Res., vol. 38, no. 16, pp. 3913-3935, 2000.
38. _, "Optimal bidirectional spine layout for overhead material handling systems," IEEE Trans. Semiconduct. Manufact., vol. 14, no. 1, pp. 57-64, Feb. 2001.
39. J. T. Lin, F. K. Wang, and C. K. Wu, "Connecting transport AMHS in a wafer fab," Int. J. Prod. Res., vol. 41, no. 3, pp. 529-544, 2003.
40. W. L. Maxwell and J. A. Muckstadt, "Design of automatic guided vehicle systems," Inst. Indust. Eng. Trans., vol. 14, no. 2, pp. 114-124, 1982.
41. J. T. Lin, F. K. Wang, and C. K. Wu, "Simulation analysis of the connecting transport AMHS in a wafer fab," IEEE Trans. Semiconduct. Manufact., vol. 16, no. 3, pp. 555-564, Aug. 2003.
42. J. T. Lin, F. K. Wang, and J. R. Young, "Virtual vehicle in the connecting transport automated material-handling system (AMHS)," Int. J. Prod. Res., vol. 42, no. 13, pp. 2599-2610, Jul. 2004.
43. P. M. C. Hesen, P. J. J. Renders, and J. E. Rooda, "Application of a layout/material handling design method to a furnace area in a 300 mm wafer fab," Int. J. Adv. Manuf. Technol., vol. 17, pp. 216-220, 2001.
44. H. P. Huang and C. T. Wang, "Modeling and performance evaluation for automated material handling systems in a 300 mm foundry fab," in Proc. IEEE Int. Conf. Robotics Automation, May 2002, pp. 3181-3186.
45. L. W. Wein, "Scheduling semiconductor wafer fabrication," IEEE Trans. Semiconduct. Manufact., vol. 1, no. 3, pp. 115-130, Aug. 1988.
46. A. Beschorner and D. Gluer, "MaxFlow theory for availability calculation of automated material handling systems," Robotics Computer Integrated Manufact., vol. 19, pp. 141-145, 2003.
47. E. Campbell, R. Wright, J. Cheatham, M. Schulz, and J. L. Berry, "Simulation modeling for 300 mm semiconductor factories," Solid State Technol., pp. 95-104, Oct. 2000.
48. D. D. Pillai, E. L. Bass, J. C. Dempsey, and E. J. Yellig, "300-mm full factory simulations for 90- and 65-nm IC manufacturing," IEEE Trans. Semiconduct. Manufact., vol. 17, no. 3, pp. 115-130, Aug. 2004.
49. G. Nadoli and D. Pillai, "Simulation in automated material handling system design for semiconductor manufacturing," in Proc. Winter Sim. Conf., 1994, pp. 892-899.
50. N. G. Pierce and R. Stafford, "Modeling and simulation of material handling for semiconductor wafer fabrication," in Proc. Winter Sim. Conf., 1994, pp. 900-906.
51. G. Cardarelli and P. Marcello, "Simulation tool for design and management optimization of automated interbay material handling and storage systems for large wafer fab," IEEE Trans. Semiconduct. Manufact., vol. 8, no. 1, pp. 44-49, Feb. 1995.
52. T. Jefferson, M. Rangaswami, and G. Stoner, "Simulation in the design of ground-based intrabay automation systems," in Proc. Winter Sim Conf., 1996, pp. 1008-1013.
53. R. Kurosaki, N. Nagao, H. Komoda, Y. Watanabe, and H. Yano, "AMHS for 300 mm wafer," in Proc. Int. Symp. Semiconductor Manufacturing Conf., 1997.
54. G. T. Mackulak, F. P. Lawrence, and T. Colvin, "Effective simulation model reuse: A case study for AMHS modeling," in Proc. Winter Sim. Conf., 1998, pp. 979-984.
55. G. T. Mackulak, F. P. Lawrence, and J. Rayter, "Simulation analysis of 300 mm intrabay automation vehicle capacity alternatives," in Proc. IEEE/SEMI Adv. Semiconduct. Manufact. Conf., 1998, pp. 445-450.
56. G. T. Mackulak and P. Savory, "A simulation-based experiment for comparing amhs performance in a semiconductor fabrication facility," IEEE Trans. Semiconduct. Manufact., vol. 14, no. 3, pp. 273-280, Aug. 2001.
57. C. D. DeJong and S. A. Fischbein, "Integrating dynamic fab capacity and automation models from 300 mm semiconductor manufacturing," in Proc. Winter Sim. Conf., 2000, pp. 1505-1509.
58. I. Paprotny, J. Yngev, and R. J. Gaskins, "Applying conservative distributed simulation to a large scale automated material handling design," in Proc. Western Multiconf. Communication Networks and Distributed Systems Modeling and Simulation Conf., San Diego, CA, 2000.
59. I. Paprotny, J. Y. Shiau, Y. Huh, and G. T. Mackulak, "Simulation based comparison of semiconductor AMHS alternatives: Continuous flow versus overhead monorail," in Proc. Winter Sim. Conf., 2000, pp. 1333-1338.
60. N. Bahri and R. J. Gaskins, "Automated material handling system traffic control by means of node balancing," in Proc. Winter Sim. Conf, 2000, pp. 1344-1346.
61. M. Schulz, T. D. Stanley, and B. Renelt, "Simulation based decision support for future 300 mm automated material handling," in Proc. Winter Sim. Conf., 2000, pp. 1518-1522.
62. J. Jimenez, B. Kim, J. Fowler, G. Mackulak, and Y. I. Choung, "Operational modeling and simulation of an inter-bay AMHS in semiconductor wafer fabrication," in Proc. Winter Sim. Conf., 2002, pp. 137-1382.
63. D. Nazzal and D. A. Bodner, "A simulation-based design framework for automated material handling systems in 300 mm fabrication facilities," in Proc. Winter Sim. Conf., pp. 1351-1359.
64. F. K. Wang and J. T. Lin, "Performance evaluation of an automated material handling system for a wafer fab," Robotics Comput. Integrated Manufact., vol. 20, pp. 91-100, 2004.
65. International Technology Roadmap for Semiconductors Factory Integration, 2003 Edition.