The evaluation of manual FOUP handling in 300-mm wafer fab

IEEE Transactions on Semiconductor Manufacturing

Volumn 16, Issue 3, 2003, Pages 551-554

  Wang, Mao Jiun J ^a   Chung, Hsiu Chen ^b   Wu, Hsin Chieh ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b HUAFAN UNIVERSITY   (Taiwan)

^c CHAOYANG UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

300 mm wafers; FOUP; Manual handling; MAWL; MSDs; PGV

Indexed keywords

ACCIDENT PREVENTION; INDUSTRIAL ROBOTS; MATERIALS HANDLING; OCCUPATIONAL DISEASES; PRODUCTION ENGINEERING; PRODUCTIVITY; SEMICONDUCTOR DEVICE MANUFACTURE;

FRONT OPENING UNIFIED PODS; MANUAL HANDLING; MANUAL WAFER HANDLING; MUSKOSKELETAL DISORDER; PERSONAL GUIDED VEHICLES; TRADITIONAL CART;

SILICON WAFERS;

EID: 0042887635     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2003.815207     Document Type: Article

References (4)

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