Application of a layout/material handling design method to a furnace area in a 300 mm wafer fab

International Journal of Advanced Manufacturing Technology

Volumn 17, Issue 3, 2001, Pages 216-220

  Hesen, P M C ^a   Renders, P J J ^a   Rooda, J E ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Automation; Layout design method; Material handling; Semiconductor

Indexed keywords

AUTOMATION; ELECTRONICS INDUSTRY; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

FURNACE AREA; PRODUCT SAFETY;

MATERIALS HANDLING;

EID: 0034802698     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001700170193     Document Type: Article

References (20)

1. Design process of a material handling system in a virtual production system
2. Application of a layout design method to a dielectrics decomposition area in a 300 mm water fab
3. Design of industrial systems
4. Shop floor control systems - From design to implementation
5. The modelling of industrial systems
6. The control of industrial systems
7. Solution methods for waiting line problems