Integration of 300 mm fab layouts and material handling automation

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 23-26

  Pillai, D ^a   Quinn, T ^a   Kryder, K ^a   Charlson, D ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ECONOMIC AND SOCIAL EFFECTS; MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE; COST BENEFIT ANALYSIS; FACTORY AUTOMATION; INDUSTRIAL ELECTRONICS; MATERIALS HANDLING;

AUTOMATED MATERIAL HANDLING SYSTEMS; COST BENEFITS; CROSS-FUNCTIONAL; FACTORY INTEGRATION; HIGH VOLUMES; INTEGRATED DESIGNS; MATERIAL HANDLING; TRADE OFF;

MATERIALS HANDLING; SEMICONDUCTOR DEVICE MANUFACTURE;

AUTOMATED MATERIAL HANDLING SYSTEMS (AMHS);

EID: 0033320285     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1999.808729     Document Type: Conference Paper

References (5)

1. Global Joint Guidelines for 3001nm hctories, 13001/J300 Factory Integration synergy, Seniatecli Web sitc.
2. Pillai, Llcvadas and Srinivasan, S, "Material Ilandling Automation in 300mni wafer fabrication facilitics", ISSM paper, 'Tokyo, 1996.
3. Ciargini, Paolo and Pillai, 1)evadas. "liitegl. atcd Ihciiir\ dcsigns for 300mm facilities" SI-MICON Japan. Dcc 1997
4. Bass, Eddy and Pillai, Devadas, "Importancc of Factory Standardiratioo for 3001nm Cost Rcductioii, SFMI(:ON Kansai, June 1999.
5. S Intcmational Technology Roadmap lor Sctnconductors, I999 Vcrsion, Factory Iutegratmii Chapter. Potential Solutions for Material Ilandling Systems.