Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages

Microelectronics Reliability

Volumn 50, Issue 12, 2010, Pages 2071-2077

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Sheng, Zhong ^a   Yu, Sheng Lin ^a,b   Chen, Yan ^c   Dai, Wei ^a   Ji, Feng ^a   Guang, Zeng ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

^c HARBIN WELDING INSTITUTE   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ARRHENIUS MODELS; CREEP DISTRIBUTION; CREEP STRAIN; FINE PITCH; FINITE ELEMENT SIMULATIONS; FRACTURE SURFACES; LEAD-FREE SOLDERED JOINTS; QUAD FLAT PACKAGE; SIMULATED RESULTS; SN-AG-CU; STRESS AND STRAIN;

CERIUM; CERIUM COMPOUNDS; CRACKS; CREEP; EXPERIMENTS; FINITE ELEMENT METHOD; SILVER; SILVER ALLOYS; TIN; TIN ALLOYS;

SOLDERED JOINTS;

EID: 78649447534     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.05.008     Document Type: Article

References (56)

1. D.M. Pierce, S.D. Sheppard, P.T. Vianco, J.A. Regent, and J.M. Grazier Validation of a general fatigue life prediction methodology for Sn-Ag-Cu lead-free solder alloy interconnects J Electron Packag 130 1 2008 1 12
2. L. Zhang, S.B. Xue, F.Y. Lu, Z.J. Han, and J.X. Wang Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads China Weld 17 2 2008 37 41
3. F. Cheng, H. Nishikawa, and T. Takemoto Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co J Mater Sci 43 10 2008 3643 3648
4. B. Reddy, P. Bhattacharya, B. Singh, and K. Chattopadhyay The effects of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy J Mater Sci 44 9 2009 2257 2263
5. H.T. Ma, and J.C. Suhling A review of mechanical properties of lead-free solders for electronic packaging J Mater Sci 44 5 2009 1141 1158
6. A. Choubey, M. Osterman, and M. Pecht Microstructure and intermetallic formation in SnAgCu BGA components attached with SnPb solder under isothermal aging IEEE Trans Dev Mater Reliab 8 1 2008 160 167
7. A. Choubey, H. Yu, M. Osterman, M. Pecht, L. Yonghong, and X. Ming Intermetallics characterization of lead-free solder joints under isothermal aging J Electron Mater 37 8 2008 1130 1138
8. C.M.L. Wu, and Y.W. Wong Rare-earth additions to lead-free electronic solders J Mater Sci: Mater Electron 18 1-3 2007 77 91
9. G.D. Li, Y.W. Shi, H. Hao, Z.D. Xai, Y.P. Lei, and F. Guo Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints J Mater Sci: Mater Electron 20 2 2009 186 192
10. L. Zhang, S.B. Xue, L.L. Gao, G. Zeng, Z. Sheng, and Y. Chen Effects of rare earths on properties and microstructures of lead-free solder alloys J Mater Sci: Mater Electron 20 8 2009 685 694
11. L. Zhang, S.B. Xue, Y. Chen, Z.J. Han, J.X. Wang, and S.L. Yu Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments J Rare Earth 27 1 2009 138 144
12. L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, Y. Chen, and Z. Sheng Effects of cerium on microstructure and properties of SnAgCu solders J Chinese Rare Earth Soc 27 2 2009 246 250
13. L. Zhang, S.B. Xue, L.L. Gao, Y. Chen, S.L. Yu, and Z. Sheng Effects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys J Mater Sci: Mater Electron 20 12 2009 1193 1199
14. Kim DH. Reliability study of SnPb and SnAg solder joints in PBGA packages. The University of Texas at Austin; 2007.
15. Sch A, Dudek R, Auerswald E, Michel GB, Reichl H. Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation. In: Proceedings of 53rd electronic components and technology conference, New Orleans, USA, May; 2003. p. 603-10.
16. Cho A, Osterman M, Pecht M, Hillman D. Durability of repaired and aged lead-free electronic assemblies. IPC Printed Circuits Expo, APEX, and designers summit, Los Angeles, CA, February; 2007. p. 18-22.
17. Shawkret A. Study on the high temperature reliability of lead-free surface mount solder joints. Shanghai Institute of Metallurgy, Chinese Academy of Sciences; 2001.
18. S.B. Xue, Y.F. Hu, and S.L. Yu Reliability of CBGA soldered joint under thermal cycling Trans China Weld Inst 26 10 2005 81 83
19. J.H.L. Pang, B.S. Xiong, and T.H. Low Low cycle fatigue models for lead-free solders Thin Solid Films 462-463 2004 408 412
20. H.T. Ma Constitutive models of creep for lead-free solders J Mater Sci 44 14 2009 3841 3851
21. L. Zhang, S.B. Xue, S.L. Yu, Z.J. Han, L.L. Gao, and F.Y. Lu Application of FEM analysis in reliability of micro-joints Electric Welding Machine 38 9 2008 13 21,72
22. B. Vandevelde, M. Gonzalez, P. Limaye, P. Ratchev, and E. Beyne Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages Microelectron Reliab 47 2-3 2007 259 265
23. J.H. Lau, S.H. Pan, and C. Chang Creep analysis of wafer level chip scale package (WLCSP) with 96.5Sn-3.5Ag and 100In lead-free solder joints and microvia build-up printed circuit board J Electron Packag 124 2 2002 69 76
24. S.C. Tse, R.S. Chen, and C.C. Lio Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package The Int J Adv Manuf Technol 31 1-2 2006 1 9
25. J.W. Kim, and S.B. Jung Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation Microelectron Eng 82 3-4 2005 554 560
26. J.H. Lau, and S.W.R. Lee Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip package on buildup microvia printed circuit board IEEE Trans Electron Packag Manuf 25 1 2002 51 58
27. P. Hegde, A.R. Ochana, D.C. Whalley, and V.V. Silberschmidt Finite element analysis of lead-free surface mount devices Comput Mater Sci 43 1 2008 212 220
28. Z.J. Han, S.B. Xue, J.X. Wang, X. Zhang, L. Zhang, and S.L. Yu Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology Trans Nonferr Metal Soc China 18 4 2008 814 818
29. Brown LM. Comparing reliability predictions to field data for plastic parts in a military, airborne environment. In: Reliability and maintainability symposium, Tampa Florida, USA; 2003. p. 207-13.
30. S.B. Xue, Y.X. Wu, Z.J. Han, and J.X. Wang Effects of lead widths and pitches on reliability of quad flat package (QFP) soldered joints Chinese J Mech Eng 20 4 2007 40 443
31. X.Y. Wang, and S.L. Yu Research about PCB cleaning process after soldering Electron Weld Machine 38 9 2008 69 72
32. A. Perkins, and S.K. Sitaraman Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages Microelectron Reliab 47 12 2007 2260 2274
33. Q. Zhang, A. Dasgupta, D. Nelson, and H. Pallavicini Systematic study on thermo-mechanical durability of Pb-free assemblies: experiments and FE analysis J Electron Packag 127 4 2005 415 429
34. Y.E. Shin, J.H. Lee, Y.W. Koh, and C.W. Lee A study on μBGA solder joints reliability using lead-free solder materials J Mech Sci Technol 16 7 2002 919 926
35. K.N. Subramanian Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments J Mater Sci: Mater Electron 18 1-3 2007 237 246
36. Z.F. Qian, and S. Liu On the life prediction and accelerated testing of solder joints Int J Microcirc Electron Packag 22 4 1999 288 304
37. Y.F. Hu, S.B. Xue, and Y.X. Wu FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling Trans Nonferr Metal Soc China 15 S3 2005 317 322
38. A. Shirazi, V.F. Ahmad, and H. Lu Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles Int J Fract 151 2 2008 135 150
39. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys J Electron Mater 31 9 2002 928 932
40. Y.S. Lai, and T.H. Wang Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly Microelectron Reliab 45 3-4 2005 575 582
41. L. Zhang, S.B. Xue, Z.J. Han, J.X. Wang, L.L. Gao, and Z. Sheng Mechanical properties of fine pitch devices soldered joints based on creep model Chinese J Mech Eng 21 6 2008 82 85
42. T.H. Wang, Y.S. Lai, and J.D. Wu Effect of underfill thermomechanical properties on thermal cycling fatigue reliability of flip-chip ball grid array J Electron Packag 126 4 2004 560 564
43. L. Zhang, S.B. Xue, F.Y. Lu, and Z.J. Han Finite element analysis on soldered joint reliability of QFP device with different solders Transactions of the China Welding Institution 28 10 2008 45 48,52
44. Z.F. Qian, and S. Liu On the life prediction and accelerated testing of solder joints Int J Microcirc Electron Packag 22 4 1999 288 304
45. Solomon HD. Life prediction and accelerated testing. The mechanics of solder alloy interconnects, Van Nostrand Reinhold, New York; 1993. p. 199-313.
46. Syed A. Updated life prediction models for solder joints with removal of modeling assumptions and effect of constitutive equations. In: 7th International conference on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems; 2006.
47. X.Y. Li, and Z.S. Wang Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies J Mater Process Technol 183 1 2007 6 12
48. X.Y. Li, and Z.S. Wang Thermo-fatigue life prediction methodologies for SnAgCu solder joints in flip-chip assemblies J Mech Strength 28 6 2006 893 898
49. Ma X. Analysis of mechanical and metallurgical factors relative to the failure of microelectronic surface mount solder joint. Harbin Institute of Technology; 2000.
50. Y. Qi, H.R. Ghorbani, and J.K. Spelt Thermal fatigue of SnPb and SAC resistor joints: analysis of stress-strain as a function of cycle parameters IEEE Trans Adv Packag 29 4 2006 690 700
51. Y.W. Shi, J. Tian, H. Hai, Z.D. Xai, Y.P. Lei, and F. Guo Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder J Alloy Compd 453 1-2 2008 180 184
52. K.S. Kim, S.H. Huh, and K. Suganuma Effects of intermetallic compounds on properties of SnAgCu lead-free soldered joints J Alloy Compd 352 1-2 2003 226 236
53. P. Ratchev, B. Vandevelde, and I.D. Wolf Reliability and failure analysis of Sn-Ag-Cu interconnections for PSGA packages on Ni/Au surface finish IEEE Trans Dev Mater Reliab 4 1 2004 5 10
54. Y.H. Xia, and X.M. Xie Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling J Alloy Compd 45 1-2 2008 174 179
55. D.R. Shirley, H.R. Ghorbani, and J.K. Spelt Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints Microelectron Reliab 48 3 2008 455 470
56. J.G. Lee, A. Telang, K.N. Subramanian, and T.R. Bieler Modeling thermomechanical fatigue behavior of Sn-Ag solder joints J Electron Mater 31 11 2002 1152 1159