Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints

Microelectronics Reliability

Volumn 48, Issue 3, 2008, Pages 455-470

  Shirley, Dwayne R ^a   Ghorbani, Hamid R ^b   Spelt, Jan K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

^b HATCH LTD   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; CREEP; LEAD COMPOUNDS; PLASTICITY; SOLDERED JOINTS; THERMAL FATIGUE;

CREEP DEFORMATION; TEMPERATURE TIME PROFILE; THERMAL PROFILES; THERMOMECHANICAL MODELING;

TIN COMPOUNDS;

EID: 39449088810     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.08.002     Document Type: Article

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