Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 237-246

  Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; RELIABILITY; THERMAL CYCLING; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

THERMAL EXCURSION; THERMOMECHANICAL FATIGUE BEHAVIOR;

SOLDERED JOINTS;

EID: 33845707744     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9015-5     Document Type: Article

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