Durability of repaired and aged lead-free electronic assemblies

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 2, Issue , 2007, Pages 1070-1081

  Choubey, Anupam ^a   Osterman, Michael ^a   Pecht, Michael ^a   Hillman, David ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b ROCKWELL COLLINS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EQUIPMENT MANUFACTURERS; EXPERIMENTAL STUDIES; FAILURE DISTRIBUTIONS; GLOBAL TRANSITIONS; GOVERNMENT LEGISLATIONS; LEAD FREE ELECTRONICS; LEAD FREE SOLDERS; LEAD-FREE; LEADLESS; MARKET PRESSURE; PRINTED WIRING; QUAD FLAT PACKAGE; REPLACEMENT MATERIALS; SOLDER INTERCONNECTS; TEMPERATURE CYCLES; TEST SPECIMENS;

EXHIBITIONS; LOADING; RELIABILITY; THERMAL AGING;

PRINTED CIRCUITS;

EID: 84866932076     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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7. Syed, A., "Reliability and Au Embrittlement of Lead Free Solders for BGA Applications," Proceedings of the International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Piscataway, NJ, 2001, pp. 143-147
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9. Nelson, D., H. Pallavicini, Q. Zhang, P. Friesen, and A. Dasgupta, "Manufacturing and Reliability of lead-free and Mixed System Assemblies (tin-lead/Pb-Free) in Avionics Environments," Journal of Surface Mount Technology, Vol. 17, Issue 1, 2004, pp. 17-24.
10. Hua, F., R. Aspandiar., T. Rothman, C. Anderson, G. Clemons, and M. Klier, "Solder Joint Reliability of SnCuAg BGA Components Attached with Eutectic Tin-lead Solder Paste, Journal of Surface Mount Technology, vol. 16, Issue 1, 2003, pp 34-42.
11. JCAA/JG-PP No-Lead Solder Project:-55°C to +125°C Thermal Cycle Testing Final Report, David Hillman and Ross Wilcoxon, March 15, 2006
12. Choubey A., D. Menschow, S. Ganesan, and M. Pecht, Journal of Surface Mount Technology Association, "Effect of Aging on Pull Strength of tin-lead, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components," April 2006.
13. IPC-A-610D, Acceptability of Electronic Assemblies, IPC, Bannockburn, Illinois, Feb. 2005