Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 2, 2009, Pages 186-192

  Li, Guangdong ^a   Shi, Yaowu ^a   Hao, Hu ^a   Xia, Zhidong ^a   Lei, Yongping ^a   Guo, Fu ^a   Li, Xiaoyan ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT LOADINGS; CU SUBSTRATES; ELEVATED TEMPERATURES; FRACTURE SURFACES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; ROOM TEMPERATURES; SHEAR STRENGTH REDUCTIONS; SN3.8AG-0.7CU SOLDERS; SNAG-CU LEAD-FREE SOLDERS; SOLDER JOINTS; TRACE AMOUNTS;

BRAZING; COPPER; CURING; INTERMETALLICS; LEAD; PHOTOLITHOGRAPHY; RARE EARTH ADDITIONS; RARE EARTH COMPOUNDS; RARE EARTH ELEMENTS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERED JOINTS; STRENGTH OF MATERIALS; WELDING;

SOLDERING ALLOYS;

EID: 58249089739     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-008-9696-z     Document Type: Article

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