Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package

International Journal of Advanced Manufacturing Technology

Volumn 31, Issue 1-2, 2006, Pages 1-9

  Tseng, S C ^a   Chen, R S ^a   Lio, C C ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Multilinear isotropic hardening; UBM; Viscoplasticity; WLCSP

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; EUTECTICS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SOLDERED JOINTS; STRESS ANALYSIS; VISCOPLASTICITY; WSI CIRCUITS;

CREEP MODELS; MULTILINEAR ISOTROPIC HARDENING; UNDER BUMP METALLURGY (UBM); WAFER LEVEL CHIP SCALE ASSEMBLY (WLCSP);

SOLDERING ALLOYS;

EID: 33750294215     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-005-0165-z     Document Type: Article

References (7)

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