Systematic study on thermo-mechanical durability of Pb-free assemblies: Experiments and FE analysis

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 415-429

  Zhang, Qian ^a,c   Dasgupta, Abhijit ^a   Nelson, Dave ^b   Pallavicini, Hector ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b RAYTHEON COMPANY   (United States)

^c DELL INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; THERMAL CYCLING; THERMAL LOAD; THERMOMECHANICAL TREATMENT; VISCOELASTICITY;

CIRCUIT CARD ASSEMBLY (CCA); PB-FREE SOLDERS; THERMO-MECHNICAL DURABILITY; WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE);

SOLDERED JOINTS;

EID: 29544433690     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2098812     Document Type: Article

References (22)

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