Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 575-582

  Lai, Yi Shao ^a   Wang, Tong Hong ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; DEFORMATION; ELECTRONICS PACKAGING; PLASTICITY; RELIABILITY; SOLDERING ALLOYS; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

BALL GRID ARRAYS (BGA); DEFORMATION KINETICS; SUBMODELING; THERMOMECHANICAL RELIABILITY;

FLIP CHIP DEVICES;

EID: 15744368569     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.09.007     Document Type: Article

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