Comparing reliability predictions to field data for plastic parts in a military, airborne environment

Proceedings of the Annual Reliability and Maintainability Symposium

Volumn , Issue , 2003, Pages 207-213

  Brown, Laura M ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Field data; Lessons learned; Mil Hdbk 217; Plastic encapsulated microcircuit (PEM); PRISM ; Reliability prediction

Indexed keywords

COMPUTER AIDED SOFTWARE ENGINEERING; COMPUTER SIMULATION; COST BENEFIT ANALYSIS; DIGITAL CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; PLASTIC PARTS; PROBABILITY; QUALITY ASSURANCE;

CIRCUIT CARD ASSEMBLY; ELECTRONIC PARTS OBSOLESCENCE INITIATIVE; PLASTIC ENCAPSULATED MICROCIRCUIT; RELIABILITY PREDICTION;

RELIABILITY;

EID: 0037258966     PISSN: 0149144X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Military Handbook 217FN2, Reliability Prediction of Electronic Equipment, Department of Defense, 1995.
2. PRISM® Software, Users Manual Version 1.0, Reliability Analysis Center, 2000.
3. A. Bumbalough, Electronics Parts Obsolescence Initiative Workshop, 4 & 5 April, 2000, Baltimore, Maryland.
4. National Semiconductor Corp., Plastic Packages, August, 1999.