Microstructure and intermetallic formation in SnAgCu BGA components attached with SnPb solder under isothermal aging

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 1, 2008, Pages 160-166

  Choubey, Anupam ^a,b,c   Osterman, Michael ^a,b   Pecht, Michael ^a,b  

^a IEEE

^b UNIVERSITY OF MARYLAND   (United States)

^c Vicor   (United States)

Author keywords

Backward compatibility; BGA components; ENIG; Exemption; ImAg; ImSn; Intermetallics; Isothermal aging; Microstructure; Mixed solder joint; SnAgCu; SnPb; Solder

Indexed keywords

AGING OF MATERIALS; ELECTRONIC EQUIPMENT; INTERMETALLICS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

BACKWARD COMPATIBILITY; EXEMPTION; ISOTHERMAL AGING; MIXED SOLDER JOINTS;

MICROSTRUCTURE;

EID: 40549107504     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2007.915049     Document Type: Article

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